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UJA1023T/2R04,518

NXP Semiconductors

UJA1023T/2R04,518 by NXP Semiconductors

UJA1023T/2R04,518 by NXP Semiconductors is an Automotive IC with 16 terminals in a small outline package. It operates b/w -40 to 125°C and supports power supplies from 5.5V to 27V. This IC is ideal for automotive applications requiring a max supply current of 7.5mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 4,838 parts In-Stock

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Vyrian

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Anansix

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Nova Conductors

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One Stop Electronics

USA . 1,118 parts In-Stock

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$6.500

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Ampacity Inc.

Singapore . 811 parts In-Stock

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AZTECH Wire

Italy . 815 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,102 parts In-Stock

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UNI Independent Distributors

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Corphita

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Microchip USA

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Bastille Electronics

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Overview

Upgrade your automotive electronics with the UJA1023T/2R04,518 from NXP Semiconductors. Known for their high-quality manufacturing, NXP Semiconductors delivers reliable and efficient solutions for your automotive IC needs. This small outline package is designed for surface mounting, making it versatile for a range of applications. With a wide operating temperature range and low power consumption, this product offers exceptional value and performance. Trust NXP Semiconductors to provide you with cutting-edge technology that enhances your driving experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for automotive use.

Surface Mount: YES

Enables easy and secure assembly onto circuit boards.

Package Shape: RECTANGULAR

Allows for efficient use of space in automotive applications.

Power Supplies (V): 5.5/27

Provides a wide range of power options for flexibility in design.

No. of Terminals: 16

Offers multiple connection points for enhanced functionality.

Package Style (Meter): SMALL OUTLINE

Contributes to a compact and streamlined design.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Designed to withstand extreme cold conditions in automotive settings.

Terminal Position: DUAL

Allows for versatile installation options in the circuit.

Temperature Grade: AUTOMOTIVE

Specifically designed to meet automotive industry standards.

Maximum Supply Current (Isup): 7.5 mA

Efficiently utilizes power while providing ample current for operation.

Terminal Form: GULL WING

Facilitates secure soldering and connectivity.

Terminal Pitch: 1.27 mm

Provides precise spacing for optimal electrical connections.

Technical Specifications

Automotive ICs UJA1023T/2R04,518 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5.5/27

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

7.5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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