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CS-386

Onsemi

CS-386 by Onsemi

CS-386 by Onsemi is an Automotive IC with a power supply range of 9-17V. Operating from -40 to 125 °C, it features a max supply current of 25mA. This BIPOLAR technology device is ideal for automotive applications requiring robust performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,415 parts In-Stock

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Vyrian

USA . 1,051 parts In-Stock

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1,051

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Distributors (Availability)

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Native Components

USA . 85 parts In-Stock

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$116.512

100+ parts

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$111.851

85

$116.512

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$111.851

Northwest PG Solutions

USA . 1,273 parts In-Stock

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$128.163

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1,273

$128.163

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TANS Electronics

Latvia . 3,345 parts In-Stock

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3,345

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SupplyDigital Components

Austria . 2,824 parts In-Stock

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2,824

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Corphita

USA . 2,098 parts In-Stock

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Kulean Microsystems

USA . 1,521 parts In-Stock

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Problanco Electronics

Mexico . 1,420 parts In-Stock

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UHIMA Technologies

Türkiye . 802 parts In-Stock

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802

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Corohmni

South Africa . 244 parts In-Stock

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Overview

The CS-386 by Onsemi is a top-quality automotive IC that offers reliable performance and durability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to meet the demanding requirements of automotive applications. With a wide operating temperature range and low power consumption, the CS-386 provides exceptional value for customers looking for a high-performance solution. Whether you're designing automotive control systems or engine management systems, the CS-386 delivers the reliability and efficiency you need to get the job done.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good thermal and mechanical properties, making the product durable and reliable for automotive applications.

Power Supplies (V): 9/17

The wide range of power supply options (9V to 17V) allows flexibility in designing automotive systems and ensures compatibility with different power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures that the product can withstand harsh environmental conditions in automotive applications without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enables the product to operate effectively in cold conditions, making it suitable for automotive use in various climates.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish offers good solderability and electrical conductivity, enhancing the overall reliability and performance of the product in automotive systems.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product meets the industry standards for temperature resistance, making it a reliable choice for automotive applications where temperature fluctuations are common.

Maximum Supply Current (Isup): 25 mA

The maximum supply current of 25 mA indicates that the product has low power consumption, making it energy-efficient and suitable for automotive systems where power efficiency is crucial.

Technology: BIPOLAR

The bipolar technology used in the product provides high-speed performance and precise control, making it a suitable choice for automotive ICs that require accuracy and efficiency in operation.

Technical Specifications

Automotive ICs CS-386 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-609 Code:

e0

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

FLIP CHIP

Power Supplies (V):

9/17

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

25 mA

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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