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SN76810P

Texas Instruments

SN76810P by Texas Instruments

Texas Instruments SN76810P is an Automotive IC with 8 terminals in a rectangular plastic/epoxy package. Operating temperature range from 0 to 70°C, suitable for commercial applications. Utilizes bipolar technology with through-hole terminals at 2.54mm pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,986 parts In-Stock

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Vyrian

USA . 3,573 parts In-Stock

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First Choice Components Inc.

USA . 30 parts In-Stock

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30

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LittleDiode

UK . 10 parts In-Stock

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10

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One Stop Electronics

USA . 535 parts In-Stock

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$3.500

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535

$3.500

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AZTECH Wire

Italy . 781 parts In-Stock

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$14.994

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Parana Technologies

USA . 324 parts In-Stock

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$19.221

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$19.264

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324

$19.221

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$19.264

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ChromeModa Solutions

Germany . 2,090 parts In-Stock

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$21.597

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$17.710

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$21.597

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IDEA Electronic Components Group

UK . 125 parts In-Stock

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$21.597

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$20.517

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$19.437

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Corphita

USA . 1,988 parts In-Stock

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DigiPath Technology Company

USA . 390 parts In-Stock

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$19.472

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Perfect Parts

USA . 148 parts In-Stock

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Overview

Unlock unparalleled performance with the SN76810P by Texas Instruments, a cutting-edge Automotive IC that sets new standards in quality and reliability. Designed to excel in demanding environments, this product offers countless benefits to customers including enhanced efficiency, durability, and versatility. Whether you're looking to optimize vehicle performance or improve safety features, the SN76810P delivers unmatched value that exceeds expectations. Trust in Texas Instruments to provide top-of-the-line solutions that drive innovation and elevate your automotive applications to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for automotive applications where weight and durability are important factors.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient board space utilization and easy integration into automotive electronic systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the IC to various components in the automotive system, enabling versatile functionality.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and maintenance, making it convenient for automotive technicians during assembly and repair.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand high temperature conditions commonly found in automotive environments, ensuring reliable performance.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this product suitable for use in a wide range of automotive climates, from cold winters to hot summers.

Terminal Position: DUAL

The dual terminal position offers increased connectivity options and improved signal integrity, enhancing the overall performance of the IC in automotive applications.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures that this IC meets industry standards for performance and reliability in automotive environments.

Technology: BIPOLAR

The use of bipolar technology in the IC ensures efficient power management and signal processing, making it an ideal choice for automotive systems requiring high-performance capabilities.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a reliable and secure connection to the circuit board, reducing the risk of disconnection or signal loss in automotive applications.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy soldering and maintenance, facilitating the assembly and repair process for automotive technicians.

Technical Specifications

Automotive ICs SN76810P attributes and parameters. Explore more Automotive ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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