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SN76810P/P3

Texas Instruments

SN76810P/P3 by Texas Instruments

Texas Instruments SN76810P/P3 is an Automotive IC with 8 terminals in a rectangular plastic/epoxy package. Operating temperature range of 0-70°C, commercial grade bipolar technology, and through-hole terminal form make it ideal for automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 3,360 parts In-Stock

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Vyrian

USA . 2,395 parts In-Stock

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2,395

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One Stop Electronics

USA . 826 parts In-Stock

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$1.500

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826

$1.500

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Semicontronic

India . 1,450 parts In-Stock

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$3.500

100+ parts

$3.412

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$3.395

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$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 1,441 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 355 parts In-Stock

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$9.123

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355

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Parana Technologies

USA . 2,073 parts In-Stock

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$15.741

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$16.103

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2,073

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$16.103

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DigiPath Technology Company

USA . 1,791 parts In-Stock

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$17.332

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$15.946

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1,791

$17.332

$15.946

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ChromeModa Solutions

Germany . 3,947 parts In-Stock

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$17.686

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$14.503

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3,947

$17.686

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IDEA Electronic Components Group

UK . 1,362 parts In-Stock

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$17.686

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$16.802

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$15.917

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1,362

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$16.802

$15.917

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Corohmni

South Africa . 344 parts In-Stock

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344

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Corphita

USA . 315 parts In-Stock

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315

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Overview

Unlock the full potential of your automotive applications with the SN76810P/P3 by Texas Instruments. Renowned for their superior quality and reliability, Texas Instruments offers a wide range of Automotive ICs designed to optimize performance and efficiency. The SN76810P/P3 is no exception, providing unmatched value and benefits to customers looking for precision and durability. Upgrade your automotive systems with this innovative solution and experience seamless operation in any environment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the IC, making it suitable for automotive applications where it may be subjected to harsh environmental conditions.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on PCB and easy integration into automotive electronic systems.

No. of Terminals: 8

Having 8 terminals provides flexibility for connecting the IC to other components in the automotive system, allowing for a variety of functionality.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to mount the IC on the PCB, saving space and enabling a more organized layout.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand high temperature environments commonly found in automotive applications.

Minimum Operating Temperature: 0 °C

The ability to operate at as low as 0°C ensures that the IC can function reliably even in cold weather conditions.

Temperature Grade: COMMERCIAL

Being a commercial grade device, this IC meets industry standards for performance and reliability, making it a dependable choice for automotive use.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise control, making this IC suitable for automotive applications that require fast response times and accuracy.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure connections to the PCB, reducing the risk of connectivity issues and enhancing the overall reliability of the automotive electronic system.

Terminal Pitch: 2.54 mm

Having a terminal pitch of 2.54 mm allows for easy soldering and alignment during assembly, making the integration of this IC into the automotive system more efficient.

Technical Specifications

Automotive ICs SN76810P/P3 attributes and parameters. Explore more Automotive ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Automotive Circuits

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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