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TJA1020TD

NXP Semiconductors

TJA1020TD by NXP Semiconductors

NXP Semiconductors' TJA1020TD is an Automotive IC in a small outline package with 8 terminals. It operates on power supplies of 5/27V and features gull wing terminals with a pitch of 1.27mm. Ideal for automotive applications requiring surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 4,159 parts In-Stock

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Anansix

USA . 2,142 parts In-Stock

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Digiode

USA . 2,100 parts In-Stock

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Vyrian

USA . 1,123 parts In-Stock

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Nova Conductors

Japan . 96 parts In-Stock

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Corohmni

South Africa . 131 parts In-Stock

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$5.116

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One Stop Electronics

USA . 190 parts In-Stock

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$5.500

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Ampacity Inc.

Singapore . 1,249 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 675 parts In-Stock

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$11.346

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Aztec Data Supply Inc.

USA . 4,964 parts In-Stock

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$21.600

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Continental Prestige Electronics

USA . 6,043 parts In-Stock

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UNI Independent Distributors

Spain . 4,670 parts In-Stock

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Perfect Parts

USA . 4,658 parts In-Stock

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Corphita

USA . 3,715 parts In-Stock

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Argo Parts USA

USA . 1,104 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Revolutionize your automotive applications with the TJA1020TD by NXP Semiconductors. Crafted with precision and expertise, this high-quality Automotive IC offers unmatched reliability and performance. Designed for efficiency and durability, it is the perfect solution for a wide range of automotive electronics, ensuring seamless communication and functionality. Experience the value and benefits of the TJA1020TD, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to heat, making the product reliable for automotive applications.

Surface Mount: YES

Surface mounting allows for easy and efficient installation on PCBs, saving space and reducing overall manufacturing costs.

Package Shape: RECTANGULAR

Rectangular shape provides uniformity and compatibility with standard PCB layouts, ensuring easy integration into existing automotive systems.

Power Supplies (V): 5/27

Support for multiple power supply voltages allows for flexible use in various automotive systems, accommodating different power requirements.

No. of Terminals: 8

Having 8 terminals provides multiple connection points, enabling the product to interface with other components effectively for enhanced functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, allowing for compact automotive designs and efficient use of available space.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connecting the product to the system, ensuring reliable performance in automotive applications.

Terminal Form: GULL WING

Gull wing terminals offer secure anchoring to the PCB, reducing the risk of disconnection or damage due to vibration or movement in automotive environments.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for high-density mounting, enabling more components to be placed closely on the PCB, which is beneficial for compact automotive systems.

Technical Specifications

Automotive ICs TJA1020TD attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/27

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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