Loading...

UJA1076TW/3V3,118

NXP Semiconductors

UJA1076TW/3V3,118 by NXP Semiconductors

UJA1076TW/3V3,118 by NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a compact 32-terminal package and operates on power supplies from 4.5V to 28V. Ideal for automotive applications, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,112

-

-

-

-

Digiode

USA . 1,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

-

-

-

-

Anansix

USA . 284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

284

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,348 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,348

$0.500

-

-

-

Microchip USA

USA . 143 parts In-Stock

1+ parts

$2.979

100+ parts

-

1k+ parts

-

10k+ parts

-

143

$2.979

-

-

-

AZTECH Wire

Italy . 1,199 parts In-Stock

1+ parts

$18.440

100+ parts

-

1k+ parts

-

10k+ parts

-

1,199

$18.440

-

-

-

Component Stockers USA

USA . 221 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$99.990

-

-

-

UNI Independent Distributors

Spain . 4,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,547

-

-

-

-

Corphita

USA . 1,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,275

-

-

-

-

Overview

Elevate your automotive designs with the UJA1076TW/3V3,118 from NXP Semiconductors. Renowned for quality and innovation, NXP delivers unmatched reliability in automotive ICs, ensuring optimal performance under extreme conditions. This compact, surface-mount solution enhances connectivity and efficiency in vehicle communication systems, offering peace of mind to engineers and manufacturers alike. Experience the blend of durability and advanced technology that drives your applications forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides excellent insulation and durability, making it well-suited for automotive applications.

Surface Mount: YES

Surface mount capability allows for a compact design and ease of integration into automated assembly processes, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape facilitates optimized board space usage and improved heat dissipation, essential for automotive environments.

Power Supplies (V): 4.5/28

Wide operating voltage range from 4.5V to 28V ensures compatibility with various automotive systems and enhances versatility across applications.

No. of Terminals: 32

Having 32 terminals allows for more complex functionality and integration within a single package, which is beneficial for advanced automotive electronics.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design enable space-saving in compact electronic systems, making this IC suitable for today's small vehicle designs.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance in high-temperature automotive environments, thus supporting long-term reliability.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this IC suitable for harsh winter conditions, providing robustness needed in diverse geographical locations.

Terminal Position: DUAL

Dual terminal positions facilitate easier integration into circuit boards, enhancing solderability and reliability in automotive applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive temperature grades, this IC guarantees performance stability and reliability under extreme environmental conditions typical in vehicles.

Terminal Form: GULL WING

Gull wing terminal form ensures better solder joint quality and mechanical stability, providing enhanced performance in vibration-prone automotive settings.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for a compact layout while maintaining electrical performance, making it ideal for densely populated automotive PCBs.

Technical Specifications

Automotive ICs UJA1076TW/3V3,118 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19