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UJA1076ATW/5V0,112

NXP Semiconductors

UJA1076ATW/5V0,112 by NXP Semiconductors

UJA1076ATW/5V0,112 by NXP Semiconductors is an automotive IC designed for robust performance in harsh environments. It operates b/w 4.5-28V with a max temp of 125 °C and features a compact 32-terminal gull-wing package. Ideal for automotive applications requiring reliable power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,172 parts In-Stock

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Digiode

USA . 3,660 parts In-Stock

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Anansix

USA . 2,256 parts In-Stock

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One Stop Electronics

USA . 558 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 1,221 parts In-Stock

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$15.510

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QUARKTWIN TECHNOLOGY LTD

USA . 22,835 parts In-Stock

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Microchip USA

USA . 3,425 parts In-Stock

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UNI Independent Distributors

Spain . 2,292 parts In-Stock

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Corphita

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Overview

Unlock the power of automotive innovation with the UJA1076ATW/5V0,112 from NXP Semiconductors. Renowned for their commitment to quality and cutting-edge technology, NXP delivers an exceptional IC tailored for robust automotive applications. Designed for reliability across extreme temperatures, this compact solution ensures seamless communication in your vehicles, enhancing safety and performance. Experience superior value and peace of mind as you drive into the future!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resilience against harsh environmental conditions typically found in automotive applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint, enabling more compact circuit designs, which is essential in modern automotive electronics.

Package Shape: RECTANGULAR

A rectangular package shape facilitates efficient space utilization on printed circuit boards, aiding in flexible design layouts.

Power Supplies (V): 4.5/28

The wide range of operating voltage makes it versatile for various automotive electronic applications, from low-power to higher demanding devices.

No. of Terminals: 32

Having 32 terminals allows for multiple connections and functionalities, making this IC suitable for complex automotive systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The slim and compact package style is ideal for modern automotive computers where space constraints are critical.

Maximum Operating Temperature: 125 °C

Operating up to 125 °C ensures reliable performance in high-temperature environments often found in automotive engines and electronics.

Minimum Operating Temperature: -40 °C

Withstand temperatures as low as -40 °C, this IC can operate in extreme cold, making it suitable for a wide range of geographical conditions.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility, allowing for adaptable PCB designs in automotive applications.

Temperature Grade: AUTOMOTIVE

This component is designed specifically for automotive environments, ensuring it meets strict quality and reliability standards for vehicle applications.

Maximum Supply Current (Isup): 0.097 mA

The low supply current helps in reducing power consumption, contributing to the overall energy efficiency of automotive systems.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical stability, ensuring reliable connections in automotive environments.

Terminal Pitch: 0.635 mm

The fine terminal pitch allows for high-density packaging, making it suitable for compact and sophisticated electronic designs in vehicles.

Technical Specifications

Automotive ICs UJA1076ATW/5V0,112 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

.097 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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