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UJA1076ATW/5V0WD,1

NXP Semiconductors

UJA1076ATW/5V0WD,1 by NXP Semiconductors

UJA1076ATW/5V0WD,1 from NXP Semiconductors is an automotive IC designed for robust performance with a max temp of 125 °C and operates b/w 4.5-28V. It features a compact 32-terminal gull-wing package, ideal for space-constrained applications. This device ensures reliable operation in harsh environments, making it perfect for automotive systems.

Median Price

$3.399

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,997 parts In-Stock

1+ parts

$3.399

100+ parts

$3.220

1k+ parts

$3.086

10k+ parts

-

1,997

$3.399

$3.220

$3.086

-

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

$3.455

100+ parts

$2.971

1k+ parts

$2.590

10k+ parts

-

2,000

$3.455

$2.971

$2.590

-

Element14

Singapore . 835 parts In-Stock

1+ parts

$429.830

100+ parts

$316.010

1k+ parts

$226.880

10k+ parts

-

835

$429.830

$316.010

$226.880

-

Rochester

USA . 20,680 parts In-Stock

1+ parts

-

100+ parts

$2.410

1k+ parts

$2.160

10k+ parts

$2.030

20,680

-

$2.410

$2.160

$2.030

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.700

10k+ parts

$2.538

10,000

-

-

$2.700

$2.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 87 parts In-Stock

1+ parts

$1.872

100+ parts

-

1k+ parts

-

10k+ parts

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87

$1.872

-

-

-

Maritex

Poland . 2,000 parts In-Stock

1+ parts

$3.464

100+ parts

$2.117

1k+ parts

$1.759

10k+ parts

-

2,000

$3.464

$2.117

$1.759

-

Vyrian

USA . 7,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,756

-

-

-

-

Chip Stock

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,500

-

-

-

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Anansix

USA . 2,608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,608

-

-

-

-

Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

-

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VRG Components

USA . 1,998 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,998

-

-

-

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ComSIT Distribution GmbH

Germany . 1,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,980

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-

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ComSIT USA

USA . 1,980 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,980

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,560 parts In-Stock

1+ parts

$1.773

100+ parts

-

1k+ parts

-

10k+ parts

-

3,560

$1.773

-

-

-

Continental Prestige Electronics

USA . 835 parts In-Stock

1+ parts

$5.060

100+ parts

$3.370

1k+ parts

-

10k+ parts

-

835

$5.060

$3.370

-

-

Perfect Parts

USA . 49,280 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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49,280

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-

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Futuretech Components

Singapore . 26,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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26,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,475 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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20,475

-

-

-

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UNI Independent Distributors

Spain . 8,074 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,074

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-

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Microchip USA

USA . 6,243 parts In-Stock

1+ parts

-

100+ parts

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6,243

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,000

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-

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-

Overview

Elevate your automotive designs with the UJA1076ATW/5V0WD,1 from NXP Semiconductors, a trusted leader in high-quality automotive ICs. This compact, robust component guarantees superior performance even in extreme temperatures, ensuring reliability on every journey. With its surface mount technology, it simplifies integration and saves space, providing unmatched value for manufacturers seeking efficiency and durability in their applications. Drive innovation forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to harsh automotive environments, making the IC reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly, optimizing manufacturing efficiency and saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape is conducive for uniform spacing and layout on circuit boards, facilitating easier integration into various automotive applications.

Power Supplies (V): 4.5/28

A wide input voltage range of 4.5V to 28V makes this IC versatile for various automotive power supply systems, enhancing compatibility.

No. of Terminals: 32

With 32 terminals, this IC can support a rich variety of functions and interfaces, making it suitable for complex automotive electronic systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design optimize space usage on the PCB, ideal for modern vehicles where space is limited.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance even in extreme conditions typical in automotive applications.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes the IC suitable for use in various climates, ensuring reliable functionality in cold conditions.

Terminal Position: DUAL

Dual terminal positioning helps in better connectivity and improved signal integrity, essential for automotive communication systems.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds allows for effective soldering while minimizing thermal stress on the component.

Peak Reflow Temperature (°C): 260

With a peak reflow temperature of 260 °C, the IC can withstand modern soldering techniques, ensuring compatibility with contemporary manufacturing processes.

Temperature Grade: AUTOMOTIVE

An automotive temperature grade indicates that the IC is designed to meet the rigorous standards and reliability requirements of automotive applications.

Maximum Supply Current (Isup): 0.097 mA

A low maximum supply current of 0.097 mA highlights energy efficiency, reducing overall power consumption in automotive systems.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and reliability in solder joints, essential for ensuring longevity in automotive applications.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for high-density designs while maintaining ease of soldering, suitable for compact automotive electronics.

Technical Specifications

Automotive ICs UJA1076ATW/5V0WD,1 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

.097 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

UJA1076ATW/5V0WD,1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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