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CS-453TH

Onsemi

CS-453TH by Onsemi

CS-453TH by Onsemi is an Automotive IC with 12V supply voltage. It features a rectangular package style with 5 terminals in zig-zag position. Ideal for automotive applications requiring PLASTIC/EPOXY material and Tin/Lead terminal finish.

Median Price

$10.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Voyager Components

USA . 20 parts In-Stock

1+ parts

$10.000

100+ parts

$10.000

1k+ parts

$10.000

10k+ parts

$10.000

20

$10.000

$10.000

$10.000

$10.000

Vyrian

USA . 2,032 parts In-Stock

1+ parts

-

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-

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2,032

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-

-

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Digiode

USA . 202 parts In-Stock

1+ parts

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-

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202

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 327 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

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327

$10.000

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-

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Kulean Microsystems

USA . 7,379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,379

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-

-

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TANS Electronics

Latvia . 5,131 parts In-Stock

1+ parts

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5,131

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SupplyDigital Components

Austria . 4,259 parts In-Stock

1+ parts

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4,259

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Problanco Electronics

Mexico . 4,090 parts In-Stock

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4,090

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Native Components

USA . 862 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.401

10k+ parts

-

862

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-

$3.401

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Corphita

USA . 834 parts In-Stock

1+ parts

-

100+ parts

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834

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UHIMA Technologies

Türkiye . 828 parts In-Stock

1+ parts

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828

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Northwest PG Solutions

USA . 550 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$3.436

10k+ parts

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550

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$3.436

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Overview

Revolutionize your automotive designs with the CS-453TH from Onsemi, a leading manufacturer in the industry. This high-quality automotive IC offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. With its innovative design and advanced features, the CS-453TH delivers exceptional value and benefits to our customers, ensuring superior performance and efficiency in every use. Upgrade your projects with the best in automotive IC technology and experience the difference with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat and chemicals, ensuring the longevity and reliability of the product.

Package Shape: RECTANGULAR

Rectangular packages are commonly used in automotive applications for easy mounting and space efficiency.

Nominal Supply Voltage (Vsup): 12 V

The 12V supply voltage is a standard in automotive systems, making this product compatible with a wide range of vehicles.

No. of Terminals: 5

Having 5 terminals allows for the connection of multiple components or signals, enhancing the functionality of the product.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good conductivity and solderability, ensuring a secure and stable connection in automotive environments.

Terminal Position: ZIG-ZAG

Zig-zag terminal position helps in reducing cross-talk and interference, improving the overall performance of the product.

Terminal Form: THROUGH-HOLE

Through-hole terminals are robust and provide mechanical stability, making them suitable for automotive applications that may experience vibrations and shocks.

Terminal Pitch: 1.7 mm

A terminal pitch of 1.7mm offers a good balance between space efficiency and ease of soldering, making it convenient for assembly and maintenance.

Technical Specifications

Automotive ICs CS-453TH attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PZIP-T5

JESD-609 Code:

e0

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP5H,.15,.7,67TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.7 mm

Terminal Position:

ZIG-ZAG

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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