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CS-387

Onsemi

CS-387 by Onsemi

CS-387 by Onsemi is an Automotive IC with a power supply of 9/17V and operating temperature range of -40 to 150 °C. It features a max supply current of 25mA, suitable for automotive applications due to its bipolar technology and tin/lead terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,462 parts In-Stock

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Digiode

USA . 908 parts In-Stock

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908

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 663 parts In-Stock

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$0.400

100+ parts

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$0.384

663

$0.400

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$0.384

Northwest PG Solutions

USA . 1,653 parts In-Stock

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$0.440

100+ parts

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$0.388

1,653

$0.440

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$0.388

TANS Electronics

Latvia . 7,956 parts In-Stock

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7,956

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Kulean Microsystems

USA . 4,969 parts In-Stock

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4,969

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Problanco Electronics

Mexico . 3,442 parts In-Stock

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3,442

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SupplyDigital Components

Austria . 1,669 parts In-Stock

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Corphita

USA . 1,513 parts In-Stock

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1,513

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UHIMA Technologies

Türkiye . 514 parts In-Stock

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514

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Corohmni

South Africa . 217 parts In-Stock

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Overview

Experience the superior quality and reliability of the CS-387 by Onsemi, a leading manufacturer in automotive ICs. This versatile product offers a wide range of applications in the automotive industry, providing customers with exceptional performance and durability. With its high-quality materials and advanced technology, the CS-387 ensures efficient power supplies and optimal operating temperatures, making it a valuable investment for any automotive project. Upgrade your systems today with the CS-387 and enjoy the benefits of top-notch performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the integrated circuits, making them suitable for automotive applications where harsh conditions may be present.

Power Supplies (V): 9/17

The wide range of power supply options allows flexibility in compatibility with different automotive systems, ensuring reliable performance in various vehicle environments.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this product can withstand extreme heat conditions often found in automotive settings, ensuring consistent functionality.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enables the integrated circuits to perform reliably in cold environments, making them suitable for all-weather automotive applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and ensures stable connections, contributing to the longevity and robustness of the product in automotive environments.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive use, this product meets the rigorous temperature and performance standards required in vehicles, ensuring reliability and safety on the road.

Maximum Supply Current (Isup): 25 mA

The low maximum supply current requirement of 25 mA helps in minimizing power consumption and heat generation, enhancing the efficiency and longevity of the integrated circuits in automotive systems.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise control, making these integrated circuits well-suited for automotive applications where reliability and accuracy are crucial.

Technical Specifications

Automotive ICs CS-387 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-609 Code:

e0

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

FLIP CHIP

Power Supplies (V):

9/17

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

25 mA

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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