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SN65HVDA100QDQ1

Texas Instruments

SN65HVDA100QDQ1 by Texas Instruments

SN65HVDA100QDQ1 by Texas Instruments is an Automotive IC with AEC-Q100 screening. It operates b/w -40 to 125°C, with power supplies of 5/27V and a max supply current of 7.5mA. This small outline package with gull wing terminals is ideal for automotive applications requiring robust performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,163 parts In-Stock

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Digiode

USA . 420 parts In-Stock

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420

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One Stop Electronics

USA . 1,304 parts In-Stock

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$0.500

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1,304

$0.500

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Semicontronic

India . 471 parts In-Stock

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$2.500

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$2.438

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$2.425

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471

$2.500

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$2.425

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Parana Technologies

USA . 388 parts In-Stock

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$2.610

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$3.100

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388

$2.610

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$3.100

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ChromeModa Solutions

Germany . 1,633 parts In-Stock

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$2.933

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$2.405

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$2.933

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IDEA Electronic Components Group

UK . 1,335 parts In-Stock

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$2.933

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$2.640

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1,335

$2.933

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$2.640

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AZTECH Wire

Italy . 810 parts In-Stock

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$5.291

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810

$5.291

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Ampacity Inc.

Singapore . 1,584 parts In-Stock

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$6.500

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$6.500

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Corphita

USA . 2,718 parts In-Stock

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DigiPath Technology Company

USA . 1,200 parts In-Stock

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$2.644

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$2.644

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Corohmni

South Africa . 371 parts In-Stock

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Overview

Enhance the performance and reliability of your automotive applications with the SN65HVDA100QDQ1 from Texas Instruments. Designed with top-notch quality and precision, this Automotive IC offers unparalleled value and benefits to our customers. As a leader in the industry, Texas Instruments ensures that our products meet the highest standards for safety, durability, and efficiency. Trust in the SN65HVDA100QDQ1 to deliver seamless connectivity and optimized functionality for your automotive systems, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good thermal performance and vibration resistance, making it suitable for automotive applications where reliability is crucial.

Surface Mount: YES

Surface mount capability enables easy and efficient PCB assembly, saving time and cost during manufacturing.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making the product ideal for automotive applications that demand stringent quality standards.

Power Supplies (V): 5/27

Support for different power supply voltages (5V and 27V) offers flexibility in design and allows compatibility with various automotive systems.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of PCB space and facilitates easy integration into automotive electronic systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance in automotive environments where temperature can vary widely.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows the product to function effectively even in cold automotive environments.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification indicates that the product meets the stringent temperature requirements of automotive applications, ensuring reliability under harsh conditions.

Maximum Supply Current (Isup): 7.5 mA

Low maximum supply current of 7.5 mA helps in minimizing power consumption, making it energy-efficient for automotive electronic systems.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical and electrical connections, enhancing the product's reliability in automotive applications subject to vibration and shock.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27 mm enables high-density mounting on PCBs, facilitating compact design and saving space in automotive electronic systems.

Technical Specifications

Automotive ICs SN65HVDA100QDQ1 attributes and parameters. Explore more Automotive ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/27

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

7.5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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