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CS-4121DW20

Onsemi

CS-4121DW20 by Onsemi

CS-4121DW20 by Onsemi is an Automotive IC with 20 terminals in a small outline package. It operates b/w -40 °C to 105°C, suitable for industrial applications. With power supplies of 8/16V and max supply current of 125mA, it utilizes bipolar technology for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,407 parts In-Stock

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Digiode

USA . 2,230 parts In-Stock

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2,230

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 573 parts In-Stock

1+ parts

$0.126

100+ parts

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$0.121

573

$0.126

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$0.121

Northwest PG Solutions

USA . 1,140 parts In-Stock

1+ parts

$0.139

100+ parts

-

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$0.122

1,140

$0.139

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$0.122

SupplyDigital Components

Austria . 8,303 parts In-Stock

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8,303

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Kulean Microsystems

USA . 3,430 parts In-Stock

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3,430

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Problanco Electronics

Mexico . 2,824 parts In-Stock

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2,824

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TANS Electronics

Latvia . 1,210 parts In-Stock

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Corphita

USA . 767 parts In-Stock

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Corohmni

South Africa . 391 parts In-Stock

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UHIMA Technologies

Türkiye . 299 parts In-Stock

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299

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Overview

Rev up your automotive applications with the CS-4121DW20 by Onsemi. Crafted with precision and expertise, this high-quality Automotive IC offers unparalleled performance and reliability. From its durable plastic/epoxy body to its advanced technology, this product is designed to exceed expectations. Whether you're working on engine control units or power management systems, this versatile IC delivers exceptional value and benefits. Trust in Onsemi's reputation for excellence and elevate your projects to new heights with the CS-4121DW20.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of strength and flexibility, making the package durable and resistant to damage.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Power Supplies (V): 8/16

Compatible with a wide range of power supplies, offering flexibility in design and application.

No. of Terminals: 20

Provides a sufficient number of connection points for interfacing with other components and devices.

Maximum Operating Temperature: 105 °C

Ensures reliable operation in high temperature environments, improving overall product performance and longevity.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, making it suitable for a variety of automotive applications.

Technology: BIPOLAR

Offers high-performance characteristics, such as fast switching speeds and low noise, ideal for automotive electronic systems.

Technical Specifications

Automotive ICs CS-4121DW20 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/16

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

125 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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