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CS-4102EDW24

Onsemi

CS-4102EDW24 by Onsemi

CS-4102EDW24 by Onsemi is a 24-terminal Automotive IC with power supplies of 5V and 7.5/12V. It operates in temperatures ranging from -40 to 105 °C, making it suitable for industrial applications requiring a small outline package style. The IC features Gull Wing terminals and is surface mountable, with a rectangular plastic/epoxy body material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,299 parts In-Stock

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2,299

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Digiode

USA . 720 parts In-Stock

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720

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Distributors (Availability)

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Native Components

USA . 563 parts In-Stock

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$0.126

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$0.121

563

$0.126

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$0.121

Northwest PG Solutions

USA . 1,696 parts In-Stock

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$0.139

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$0.122

1,696

$0.139

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$0.122

Kulean Microsystems

USA . 4,428 parts In-Stock

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4,428

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TANS Electronics

Latvia . 2,556 parts In-Stock

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2,556

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Problanco Electronics

Mexico . 1,899 parts In-Stock

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1,899

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SupplyDigital Components

Austria . 1,173 parts In-Stock

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Corphita

USA . 395 parts In-Stock

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395

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Corohmni

South Africa . 383 parts In-Stock

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UHIMA Technologies

Türkiye . 156 parts In-Stock

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Overview

Upgrade your automotive electronics with the CS-4102EDW24 by Onsemi. With a reputation for top-notch quality and reliability, Onsemi's Automotive ICs are designed to meet the demands of today's vehicles. This small outline package with 24 terminals offers a wide range of power supplies, making it versatile for various applications. From temperature control to motor drive systems, this product ensures optimal performance in extreme conditions. Trust Onsemi to deliver value, benefits, and advantages that exceed expectations. Experience the difference with the CS-4102EDW24.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the IC, making it reliable for automotive applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Power Supplies (V): 5,7.5/12

The multiple voltage options make this IC versatile and compatible with various automotive systems.

No. of Terminals: 24

Having a sufficient number of terminals allows for more connections and functionality in automotive electronics.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB, which is crucial in automotive applications where real estate is limited.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this IC can withstand the heat generated in automotive environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the IC can function reliably in various climate conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead finish provides good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in system design and layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can withstand harsh operating conditions in automotive settings.

Terminal Form: GULL WING

Gull wing terminals are robust and provide a strong mechanical connection, ideal for automotive vibration and shock resistance.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting and efficient use of PCB space.

Technical Specifications

Automotive ICs CS-4102EDW24 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

No. of Terminals:

24

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,7.5/12

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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