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CS-3361D14

Onsemi

CS-3361D14 by Onsemi

CS-3361D14 by Onsemi is an Automotive IC with 12V supply, 14 terminals, and 10mA max supply current. It features a small outline package shape, operates b/w -40 to 125 °C, and uses bipolar technology. Ideal for automotive applications requiring high temperature tolerance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,373 parts In-Stock

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2,373

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Vyrian

USA . 618 parts In-Stock

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618

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SupplyDigital Components

Austria . 6,339 parts In-Stock

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6,339

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Northwest PG Solutions

USA . 2,283 parts In-Stock

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Problanco Electronics

Mexico . 1,290 parts In-Stock

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1,290

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Kulean Microsystems

USA . 1,063 parts In-Stock

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1,063

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Native Components

USA . 804 parts In-Stock

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804

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TANS Electronics

Latvia . 602 parts In-Stock

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602

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Corohmni

South Africa . 462 parts In-Stock

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462

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UHIMA Technologies

Türkiye . 202 parts In-Stock

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202

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Corphita

USA . 62 parts In-Stock

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Overview

Unleash the power of innovation with the CS-3361D14 by Onsemi. As a leading manufacturer in Automotive ICs, Onsemi delivers top-quality products that exceed industry standards. This versatile product is designed to provide seamless integration and superior performance in a range of automotive applications. With a nominal supply voltage of 12V and a small outline package style, this IC offers unmatched reliability and efficiency. Say goodbye to downtime and hello to unparalleled value with the CS-3361D14 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and resistant to heat and moisture, making the product reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal voltage of 12V ensures compatibility with standard automotive electrical systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environments and extreme conditions.

Technology: BIPOLAR

Bipolar technology offers reliable performance and precise control, making it suitable for automotive applications.

Technical Specifications

Automotive ICs CS-3361D14 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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