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UJA1076TW/5V0/WD,1

NXP Semiconductors

UJA1076TW/5V0/WD,1 by NXP Semiconductors

UJA1076TW/5V0/WD,1 from NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a compact 32-terminal gull-wing package and operates on power supplies b/w 4.5V and 28V. Ideal for automotive applications, it ensures reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,990 parts In-Stock

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2,990

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Digiode

USA . 2,522 parts In-Stock

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Anansix

USA . 2,480 parts In-Stock

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2,480

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One Stop Electronics

USA . 989 parts In-Stock

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$5.500

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989

$5.500

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AZTECH Wire

Italy . 492 parts In-Stock

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$12.070

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492

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UNI Independent Distributors

Spain . 5,322 parts In-Stock

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Microchip USA

USA . 3,709 parts In-Stock

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Corphita

USA . 2,201 parts In-Stock

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Overview

Unlock the power of automotive innovation with the UJA1076TW/5V0/WD,1 from NXP Semiconductors. Designed for superior performance and reliability, this cutting-edge IC enhances vehicle communication systems, ensuring seamless connectivity and safety on the road. With a rugged temperature range and compact design, it meets the demands of modern automotive applications, delivering unmatched quality and efficiency that you can trust. Elevate your automotive projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material provides excellent protection against environmental factors, making the IC reliable for automotive applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and efficient use of PCB space, facilitating easier integration into modern automotive systems.

Package Shape: RECTANGULAR

The rectangular shape enables optimal placement on the PCB, improving overall space utilization and thermal management.

Power Supplies (V): 4.5/28

A wide range of voltage supply options makes this IC suitable for various automotive applications, ensuring compatibility with different systems.

No. of Terminals: 32

With 32 terminals, this IC can accommodate multiple functions and connections, enhancing its versatility in complex automotive systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design optimize space on the circuit board, allowing for higher density designs in automotive electronics.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliable performance even under extreme conditions typical in automotive environments.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature makes this IC suitable for use in cold environments, ensuring functionality across a wide temperature range.

Terminal Position: DUAL

Dual terminal positioning improves solder joint reliability and provides greater flexibility in PCB layout design.

Temperature Grade: AUTOMOTIVE

This temperature grade signifies that the IC is designed to meet the stringent requirements of automotive applications, enhancing overall reliability.

Terminal Form: GULL WING

Gull wing terminals facilitate easier handling and soldering during assembly, improving manufacturing efficiency and reliability.

Terminal Pitch: 0.635 mm

A small terminal pitch allows for a more compact design and higher density interconnections, which is essential for modern automotive systems.

Technical Specifications

Automotive ICs UJA1076TW/5V0/WD,1 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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