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UJA1076ATW/5V0,118

NXP Semiconductors

UJA1076ATW/5V0,118 by NXP Semiconductors

UJA1076ATW/5V0,118 by NXP Semiconductors is an automotive IC designed for robust performance with a supply voltage range of 4.5-28V. It operates in extreme temperatures from -40 °C to 125 °C and features a compact 32-terminal gull-wing package. Ideal for automotive applications, it ensures reliability and efficiency in vehicle electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,193 parts In-Stock

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Flip Electronics

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Anansix

USA . 1,839 parts In-Stock

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Digiode

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Microchip USA

USA . 1,593 parts In-Stock

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$2.702

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One Stop Electronics

USA . 1,360 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 558 parts In-Stock

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$18.410

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UNI Independent Distributors

Spain . 6,341 parts In-Stock

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Corphita

USA . 859 parts In-Stock

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Overview

Elevate your automotive designs with the UJA1076ATW/5V0,118 from NXP Semiconductors, a trusted leader in high-quality automotive ICs. This compact, durable solution is engineered to excel in extreme conditions, ensuring reliability and performance. With its advanced features, it streamlines communication and energy management in vehicles, providing unmatched efficiency. Choose NXP for innovation that drives success and keeps you ahead in the competitive automotive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount compatibility allows for efficient PCB designs and saves space, contributing to compact automotive systems.

Package Shape: RECTANGULAR

The rectangular shape aids in organized layout on circuit boards, facilitating easier integration into designs.

Power Supplies (V): 4.5/28

A wide power supply range enhances versatility, accommodating various automotive power systems and ensuring reliability.

No. of Terminals: 32

The 32 terminals provide ample connectivity options, supporting complex functions and making it suitable for advanced automotive electronics.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design optimize space utilization, perfect for compact automotive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the IC can function reliably in extreme conditions typical of automotive environments.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the IC maintains functionality in very cold conditions, essential for automotive applications in diverse climates.

Terminal Position: DUAL

Dual terminal positioning allows for flexible routing and improved layout options on PCBs, enhancing design efficiency.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows the IC to withstand the soldering process without damage, ensuring reliable production.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, this IC is tailored for high reliability and performance in demanding automotive applications.

Maximum Supply Current (Isup): 0.097 mA

The low maximum supply current translates to lower power consumption, enhancing energy efficiency in automotive systems.

Terminal Form: GULL WING

Gull wing terminals offer excellent solder joint reliability and ease of assembly, important for maintaining performance in automotive environments.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm enables denser layout designs, supporting more functionality in limited space typically found in automotive applications.

Technical Specifications

Automotive ICs UJA1076ATW/5V0,118 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

.097 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UJA1076ATW/5V0,118 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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