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UJA1018TK,118

NXP Semiconductors

UJA1018TK,118 by NXP Semiconductors

UJA1018TK,118 by NXP Semiconductors is an Automotive IC with a power supply range of 5.5V to 18V and a max supply current of 4.5mA. This surface-mount IC has 16 terminals in a small outline package shape, making it ideal for automotive applications requiring high-temperature reflow processes up to 260°C.

Median Price

$1.527

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Verical

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Rochester

USA . 3,000 parts In-Stock

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$1.430

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$1.280

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Vyrian

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Flip Electronics

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Digiode

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Nova Conductors

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One Stop Electronics

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Ampacity Inc.

Singapore . 320 parts In-Stock

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AZTECH Wire

Italy . 665 parts In-Stock

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Microchip USA

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Lixinc

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UNI Independent Distributors

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Overview

Enhance the performance of your automotive applications with the UJA1018TK,118 by NXP Semiconductors. Known for their top-notch quality and reliability, NXP Semiconductors delivers cutting-edge Automotive ICs that are sure to impress. This small outline package offers a wide range of benefits, from its dual terminal position to its low supply current of 4.5 mA. Trust in NXP Semiconductors to provide you with the tools you need to take your automotive projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring reliability in automotive applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of the product onto circuit boards, saving time and effort.

Power Supplies (V): 5.5/18

The wide range of power supply voltages (5.5V to 18V) makes this product versatile and compatible with different automotive systems.

No. of Terminals: 16

With 16 terminals, this product offers a sufficient number of connection points for various input and output signals in automotive applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact automotive electronics designs.

Terminal Position: DUAL

The dual terminal position allows for more efficient routing of connections and enhanced electrical performance in automotive circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand a peak reflow temperature for up to 30 seconds, ensuring reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can handle high-temperature soldering processes, ensuring robust connections.

Maximum Supply Current (Isup): 4.5 mA

The low maximum supply current requirement of 4.5 mA helps in conserving power and reducing energy consumption in automotive systems.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and aligns with environmental regulations, making the product eco-friendly.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635 mm allows for dense packing of components on the circuit board, improving overall system integration.

Technical Specifications

Automotive ICs UJA1018TK,118 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC16,.14,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5.5/18

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

4.5 mA

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

UJA1018TK,118 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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