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CS-4121N16

Onsemi

CS-4121N16 by Onsemi

CS-4121N16 by Onsemi is an Automotive IC with 16 terminals in a rectangular plastic/epoxy package. It operates b/w -40 °C to 105°C, with power supplies of 8/16V and max supply current of 125mA. This bipolar technology IC is ideal for industrial applications requiring reliable performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,065 parts In-Stock

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Digiode

USA . 189 parts In-Stock

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Native Components

USA . 751 parts In-Stock

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$0.914

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Northwest PG Solutions

USA . 544 parts In-Stock

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$1.005

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TANS Electronics

Latvia . 8,098 parts In-Stock

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SupplyDigital Components

Austria . 7,443 parts In-Stock

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Kulean Microsystems

USA . 3,421 parts In-Stock

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Problanco Electronics

Mexico . 2,761 parts In-Stock

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Corphita

USA . 1,466 parts In-Stock

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Corohmni

South Africa . 392 parts In-Stock

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UHIMA Technologies

Türkiye . 171 parts In-Stock

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Overview

Revolutionize your automotive electronics with the CS-4121N16 by Onsemi. This high-quality Automotive IC offers unparalleled performance and reliability, thanks to Onsemi's reputation for excellence in manufacturing. Perfect for a wide range of applications, this IC provides superior power supply capabilities and temperature resistance, ensuring optimal performance in any environment. Say goodbye to worries about overheating or power failures - invest in the CS-4121N16 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good strength and durability to the package, ensuring long-term reliability in automotive applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB, making it suitable for compact automotive designs.

Power Supplies (V): 8/16

The versatility of operating with both 8V and 16V power supplies makes this IC suitable for a wide range of automotive applications.

No. of Terminals: 16

Having 16 terminals allows for connection to various components and systems within the automotive environment, enhancing functionality.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this IC can withstand harsh conditions commonly found in automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead finish provides good solderability and electrical conductivity, essential for secure connections in automotive systems.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this IC is suitable for automotive applications where temperature variations are common.

Maximum Supply Current (Isup): 125 mA

The maximum supply current of 125mA allows for efficient power consumption, making it energy-efficient in automotive systems.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and excellent noise immunity, making this IC ideal for automotive applications where reliability is crucial.

Terminal Form: THROUGH-HOLE

With a through-hole terminal form, this IC can be securely mounted on the PCB, ensuring stability and reliability in automotive environments.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for compatibility with commonly used connectors and sockets, facilitating easy integration into automotive systems.

Technical Specifications

Automotive ICs CS-4121N16 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

8/16

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

125 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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