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UJA1076ATW/3V3WD,1

NXP Semiconductors

UJA1076ATW/3V3WD,1 by NXP Semiconductors

UJA1076ATW/3V3WD,1 from NXP Semiconductors is an automotive IC designed for robust performance with a max temp of 125 °C and operates b/w 4.5-28V. It features a compact 32-terminal gull-wing package, ideal for space-constrained applications. This device ensures reliable operation in harsh environments, making it perfect for automotive systems.

Median Price

$3.060

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,216 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

$3.020

10k+ parts

$2.530

1,216

$3.060

-

$3.020

$2.530

EBV Elektronik

Germany . 10,000 parts In-Stock

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10,000

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Distributors (In-Stock)

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Digiode

USA . 4,240 parts In-Stock

1+ parts

$2.907

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4,240

$2.907

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Vyrian

USA . 2,783 parts In-Stock

1+ parts

$3.060

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2,783

$3.060

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Chip Stock

USA . 273,291 parts In-Stock

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273,291

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Anansix

USA . 2,080 parts In-Stock

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2,080

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,177 parts In-Stock

1+ parts

$2.754

100+ parts

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3,177

$2.754

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Microchip USA

USA . 4,480 parts In-Stock

1+ parts

$17.021

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4,480

$17.021

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QUARKTWIN TECHNOLOGY LTD

USA . 19,103 parts In-Stock

1+ parts

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19,103

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UNI Independent Distributors

Spain . 7,307 parts In-Stock

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7,307

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Overview

Elevate your automotive designs with the UJA1076ATW/3V3WD from NXP Semiconductors, a leader in innovation and quality. This versatile automotive IC ensures robust performance across extreme temperatures, offering exceptional reliability for critical applications. With its compact form factor and advanced power management, it allows engineers to create efficient, high-performance systems that enhance vehicle safety and functionality, all while benefiting from NXP's renowned expertise and support.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making this IC suitable for automotive applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier automation in manufacturing, enhancing overall production efficiency.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on PCBs, allowing for more components to be integrated in limited spaces.

Power Supplies (V): 4.5/28

Wide supply voltage range ensures compatibility with various automotive systems, allowing for versatility in application.

No. of Terminals: 32

A higher number of terminals enables more functionality and connectivity options within the device, promoting enhanced performance.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design facilitate space-saving in automotive designs, essential in modern vehicle electronics.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can function effectively in the harsh thermal environments commonly found in automotive applications.

Minimum Operating Temperature: -40 °C

Designed to operate in extremely cold conditions, ensuring reliability in a variety of climates and automotive scenarios.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options and application flexibility, beneficial in complex automotive systems.

Peak Reflow Temperature: 260 °C

The ability to withstand high reflow temperatures during assembly process boosts manufacturing reliability and product longevity.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade confirms this product's suitability for use in vehicles, ensuring compliance with stringent industry standards.

Maximum Supply Current (Isup): 0.097 mA

Low supply current consumption is crucial for energy efficiency, contributing to the overall power optimization of automotive systems.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, enhancing reliability and performance under mechanical stress.

Terminal Pitch: 0.635 mm

The fine terminal pitch allows for compact designs and high-density mounting, making it ideal for modern electronic systems in vehicles.

Technical Specifications

Automotive ICs UJA1076ATW/3V3WD,1 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

.097 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UJA1076ATW/3V3WD,1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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