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UJA1079ATW/5V0,112

NXP Semiconductors

UJA1079ATW/5V0,112 by NXP Semiconductors

UJA1079ATW/5V0,112 by NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a dual terminal design with 32 terminals and operates on power supplies from 4.5V to 28V. Ideal for automotive applications, it ensures reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,834 parts In-Stock

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Digiode

USA . 2,773 parts In-Stock

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Anansix

USA . 1,692 parts In-Stock

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Microchip USA

USA . 1,122 parts In-Stock

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One Stop Electronics

USA . 1,428 parts In-Stock

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$1.500

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AZTECH Wire

Italy . 953 parts In-Stock

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$19.270

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953

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UNI Independent Distributors

Spain . 7,653 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,313 parts In-Stock

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Corphita

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Overview

Unlock the future of automotive innovation with the UJA1079ATW/5V0,112 from NXP Semiconductors. Renowned for their commitment to excellence, NXP empowers your designs with unmatched reliability and precision. This advanced automotive IC seamlessly supports a wide range of applications, ensuring peak performance in demanding environments. Elevate your projects with superior efficiency, robust thermal performance, and the trusted quality that only NXP can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers excellent protection against environmental factors, making it suitable for automotive applications where reliability is critical.

Surface Mount: YES

Surface mount technology allows for increased circuit density and reliability, facilitating efficient and compact integration into automotive systems.

Package Shape: RECTANGULAR

The rectangular shape allows for optimized space utilization on circuit boards, enabling more efficient design layouts and component placement.

Power Supplies (V): 4.5/28

The wide range of operating voltages (4.5V to 28V) ensures compatibility with various automotive power systems, enhancing versatility.

No. of Terminals: 32

With 32 terminals, this IC can support complex functionality and multiple connections, making it ideal for sophisticated automotive systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design save space and allow for more efficient layouts in compact automotive environments.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125 °C ensures reliable performance under extreme conditions common in automotive applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC reliably functions in harsh winter conditions, ensuring year-round performance.

Terminal Position: DUAL

Dual terminal positioning aids in easier integration and soldering, enhancing manufacturability and reliability of connections.

Temperature Grade: AUTOMOTIVE

Rated for automotive temperature grades, this IC is designed to withstand the temperature fluctuations encountered in automotive applications.

Maximum Supply Current (Isup): 10 mA

A maximum supply current of 10 mA indicates low power consumption, extending battery life and improving overall energy efficiency in automotive systems.

Terminal Form: GULL WING

The gull wing terminal form ensures a strong connection with high reliability, aiding in the longevity and performance of automotive components.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm facilitates high-density packaging, making it suitable for modern, compact electronic designs in automotive applications.

Technical Specifications

Automotive ICs UJA1079ATW/5V0,112 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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