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TJA1020T/CM,112

NXP Semiconductors

TJA1020T/CM,112 by NXP Semiconductors

TJA1020T/CM,112 by NXP Semiconductors is an automotive IC designed for robust performance with a 5/27V power supply. It features an 8-terminal gull-wing package and withstands peak reflow temps of 260 °C. Ideal for surface mount applications in automotive electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,191 parts In-Stock

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Anansix

USA . 862 parts In-Stock

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Digiode

USA . 461 parts In-Stock

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461

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Distributors (Availability)

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One Stop Electronics

USA . 634 parts In-Stock

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$4.500

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634

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UNI Independent Distributors

Spain . 3,340 parts In-Stock

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Corphita

USA . 501 parts In-Stock

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501

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Overview

Elevate your automotive designs with the TJA1020T/CM,112 from NXP Semiconductors, a trusted leader in innovation. This robust IC ensures seamless communication in advanced vehicle systems, enhancing safety and efficiency while boasting an impressive thermal profile for reliability. Its compact size and surface-mount capabilities make integration effortless, delivering exceptional performance that drives your projects forward. Experience quality and excellence with NXP—where superior technology meets automotive needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers high durability and is resistant to thermal stress, making it suitable for automotive applications.

Surface Mount: YES

Being a surface mount device allows for a compact design and makes it easier to integrate into smaller electronic assemblies.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of space, facilitating better layout options on printed circuit boards.

Power Supplies (V): 5/27

With a versatile voltage range of 5 to 27 volts, this IC is compatible with various automotive power systems, enhancing its applicability.

No. of Terminals: 8

Having 8 terminals allows for multiple connections in a compact format, optimizing circuit complexity and functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style is designed for space efficiency, making it ideal for modern automotive electronics where space is at a premium.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, leading to improved performance and reliability in automotive environments.

Terminal Position: DUAL

The dual terminal position enhances versatility in PCB layout design, allowing for easier routing and improved signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum of 30 seconds at peak reflow temperature ensures that the component can withstand the soldering process without damage, enhancing production yield.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with lead-free soldering processes, crucial for meeting modern environmental regulations.

Terminal Form: GULL WING

The gull wing terminal form provides stability and ease of soldering, reducing assembly time and improving overall reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for high-density mounting options while maintaining sufficient spacing for soldering and assembly.

Technical Specifications

Automotive ICs TJA1020T/CM,112 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/27

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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