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UJA1076TW/5V0,118

NXP Semiconductors

UJA1076TW/5V0,118 by NXP Semiconductors

UJA1076TW/5V0,118 by NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a 32-terminal dual gull-wing design and operates on power supplies from 4.5V to 28V. Ideal for automotive applications, it ensures reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,803 parts In-Stock

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4,803

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Digiode

USA . 3,059 parts In-Stock

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Anansix

USA . 1,726 parts In-Stock

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One Stop Electronics

USA . 1,541 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 1,170 parts In-Stock

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$12.790

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Component Stockers USA

USA . 365 parts In-Stock

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$99.990

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365

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Microchip USA

USA . 4,745 parts In-Stock

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Corphita

USA . 2,515 parts In-Stock

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UNI Independent Distributors

Spain . 2,375 parts In-Stock

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Overview

Experience unparalleled reliability with the UJA1076TW/5V0,118 from NXP Semiconductors, a leader in automotive ICs. Designed for peak performance in demanding environments, this cutting-edge solution ensures optimal functionality across various applications, from advanced driver-assistance systems to electric vehicles. Enjoy the robust quality and long-lasting durability that only NXP can deliver, empowering your innovations while enhancing safety and efficiency on the road.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight packaging, making it ideal for automotive applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs and supports automated assembly.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout on the PCB, improving overall design flexibility and space management.

Power Supplies (V): 4.5/28

Wide voltage range compatibility (4.5V to 28V) makes this IC suitable for various automotive power supply designs.

No. of Terminals: 32

A higher number of terminals allows for greater connectivity options and more complex functionalities within automotive circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for compact spaces, essential for modern automotive designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and performance even in extreme automotive environments.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature guarantees functionality in harsh winter conditions commonly encountered in automotive applications.

Terminal Position: DUAL

Dual terminal positioning enhances design flexibility and ease of integration into various circuit layouts.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, ensuring compliance with stringent industry standards for safety and longevity.

Terminal Form: GULL WING

Gull wing terminals provide robust soldering connections, enhancing the reliability of the IC in automotive environments.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for high-density placement, supporting advanced and compact electronic designs.

Technical Specifications

Automotive ICs UJA1076TW/5V0,118 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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