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UJA1079ATW/5V0,118

NXP Semiconductors

UJA1079ATW/5V0,118 by NXP Semiconductors

UJA1079ATW/5V0,118 by NXP Semiconductors is an automotive IC designed for robust performance with a supply voltage range of 4.5-28V. It features a dual terminal layout and operates in extreme temperatures from -40 °C to 125 °C. Ideal for automotive applications, it ensures reliability in demanding environments.

Median Price

$1.300

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 3 parts In-Stock

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$1.300

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Rochester

USA . 2,000 parts In-Stock

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2,000

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Vyrian

USA . 4,646 parts In-Stock

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4,646

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Anansix

USA . 2,565 parts In-Stock

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2,565

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Flip Electronics

USA . 2,000 parts In-Stock

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2,000

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Digiode

USA . 1,901 parts In-Stock

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1,901

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Distributors (Availability)

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One Stop Electronics

USA . 385 parts In-Stock

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$2.500

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385

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Microchip USA

USA . 1,605 parts In-Stock

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$2.868

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1,605

$2.868

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AZTECH Wire

Italy . 118 parts In-Stock

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$12.070

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118

$12.070

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Component Stockers USA

USA . 263 parts In-Stock

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$99.990

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263

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UNI Independent Distributors

Spain . 5,725 parts In-Stock

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5,725

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Corphita

USA . 3,496 parts In-Stock

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Overview

Elevate your automotive designs with the UJA1079ATW/5V0,118 by NXP Semiconductors. Renowned for its commitment to quality and innovation, NXP delivers a high-performance IC that enhances reliability and efficiency in automotive applications. With its robust temperature range and compact design, this versatile component is ideal for advanced vehicle systems, ensuring safety and superior functionality. Experience the difference with NXP—where excellence drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient manufacturing processes, making it versatile for various automotive circuit layouts.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and facilitates better layout options on PCBs, which is critical in automotive design.

Power Supplies (V): 4.5/28

Wide voltage range ensures compatibility with various automotive systems, enhancing its versatility in different vehicle architectures.

No. of Terminals: 32

32 terminals provide ample connectivity options, enabling integration of multiple functions within a single component, which is vital for complex automotive systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile reduce space requirements on PCBs, enabling more compact designs in automotive applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can function reliably even in harsh automotive environments, ensuring safety and performance.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures ensures reliability in cold climates, making it suitable for a wide range of geographical conditions.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible PCB layout options, facilitating better integration into automotive designs.

Peak Reflow Temperature °C: 260

High peak reflow temperature indicates compatibility with modern manufacturing processes, ensuring reliability even after surface mount assembly.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, it meets stringent reliability and performance standards needed in vehicles.

Maximum Supply Current (Isup): 10 mA

Low supply current consumption contributes to overall vehicle energy efficiency, which is essential for modern automotive designs.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical stability and simplify soldering processes, enhancing manufacturing reliability.

Terminal Pitch: 0.635 mm

Fine terminal pitch supports high-density designs, allowing for more features in compact automotive electronic layouts.

Technical Specifications

Automotive ICs UJA1079ATW/5V0,118 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UJA1079ATW/5V0,118 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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