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CS-464DW16

Onsemi

CS-464DW16 by Onsemi

CS-464DW16 by Onsemi is a 16-terminal automotive IC with a supply voltage of 14V. It operates b/w -30 °C to 125°C, with a max supply current of 65mA. This small outline package in gull wing form is ideal for surface mount applications in the automotive industry.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,437 parts In-Stock

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Vyrian

USA . 2,383 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 284 parts In-Stock

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$6.177

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SupplyDigital Components

Austria . 8,118 parts In-Stock

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Problanco Electronics

Mexico . 7,913 parts In-Stock

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Kulean Microsystems

USA . 7,669 parts In-Stock

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TANS Electronics

Latvia . 3,348 parts In-Stock

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Corphita

USA . 2,238 parts In-Stock

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Northwest PG Solutions

USA . 2,209 parts In-Stock

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UHIMA Technologies

Türkiye . 710 parts In-Stock

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Corohmni

South Africa . 310 parts In-Stock

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Overview

Looking to upgrade your automotive electronics? Look no further than the CS-464DW16 by Onsemi. With a reputation for high-quality manufacturing, this automotive IC offers unparalleled reliability and performance. Whether you're working on vehicle control systems or power management applications, this product delivers exceptional value and benefits to customers. Say goodbye to technical headaches and hello to seamless integration with the CS-464DW16.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the integrated circuit, making it reliable for automotive applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost during manufacturing.

Nominal Supply Voltage (Vsup): 14 V

Operating at a nominal supply voltage of 14V makes this IC suitable for automotive systems that typically operate within this range.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this IC can withstand harsh automotive operating conditions without overheating.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise control, making this IC ideal for automotive applications that require fast and accurate processing.

Technical Specifications

Automotive ICs CS-464DW16 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

14

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

65 mA

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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