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CS-8190DW20

Onsemi

CS-8190DW20 by Onsemi

CS-8190DW20 by Onsemi is an Automotive IC with 20 terminals in a small outline package. It operates b/w -40 to 105 °C, powered by 8.5/16V supplies. Suitable for industrial applications due to its bipolar technology and tin/lead terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,593 parts In-Stock

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1,593

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Vyrian

USA . 914 parts In-Stock

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914

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 406 parts In-Stock

1+ parts

$0.144

100+ parts

-

1k+ parts

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10k+ parts

$0.138

406

$0.144

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-

$0.138

Northwest PG Solutions

USA . 741 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

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$0.140

741

$0.158

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$0.140

Kulean Microsystems

USA . 7,726 parts In-Stock

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7,726

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SupplyDigital Components

Austria . 5,334 parts In-Stock

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5,334

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TANS Electronics

Latvia . 2,040 parts In-Stock

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2,040

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Problanco Electronics

Mexico . 1,920 parts In-Stock

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1,920

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UHIMA Technologies

Türkiye . 225 parts In-Stock

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225

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Corphita

USA . 122 parts In-Stock

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122

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Corohmni

South Africa . 81 parts In-Stock

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81

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Overview

Upgrade your automotive applications with the high-quality CS-8190DW20 by Onsemi. With a reputation for excellence in manufacturing, Onsemi delivers reliable solutions for your automotive IC needs. This versatile product offers customers unmatched value and benefits, providing seamless integration into various systems. Elevate your projects with the CS-8190DW20 and experience superior performance and durability that Onsemi is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good heat resistance and durability, ensuring the product can withstand harsh operating conditions.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, reducing assembly time.

Power Supplies (V): 8.5/16

Wide range of power supply voltage options provide flexibility in designing and integrating the product into different automotive systems.

No. of Terminals: 20

Sufficient number of terminals allows for seamless connectivity and integration with other components in the automotive system.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance even in extreme temperature conditions.

Technology: BIPOLAR

Bipolar technology offers high speed and precision performance, making the product suitable for automotive applications that require fast and accurate data processing.

Technical Specifications

Automotive ICs CS-8190DW20 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8.5/16

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

125 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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