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CS-8190N16

Onsemi

CS-8190N16 by Onsemi

CS-8190N16 by Onsemi is an Automotive IC with 16 terminals in a rectangular package. It operates b/w -40 °C to 105°C, with power supplies ranging from 8.5V to 16V. This industrial-grade IC uses bipolar technology and has a max supply current of 125mA, making it suitable for automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,561 parts In-Stock

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Vyrian

USA . 266 parts In-Stock

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Native Components

USA . 171 parts In-Stock

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$0.680

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Northwest PG Solutions

USA . 1,717 parts In-Stock

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$0.748

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SupplyDigital Components

Austria . 5,702 parts In-Stock

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Problanco Electronics

Mexico . 3,836 parts In-Stock

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Kulean Microsystems

USA . 3,371 parts In-Stock

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Corphita

USA . 2,385 parts In-Stock

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TANS Electronics

Latvia . 1,801 parts In-Stock

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Corohmni

South Africa . 198 parts In-Stock

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UHIMA Technologies

Türkiye . 127 parts In-Stock

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Overview

Experience the reliability and innovation of Onsemi with the CS-8190N16 Automotive IC. Manufactured with top-quality materials and cutting-edge technology, this product offers peak performance and durability for a wide range of automotive applications. With a temperature range of -40 to 105 °C and a maximum supply current of 125 mA, customers can trust in the superior functionality and efficiency of this IC. Upgrade your automotive systems today with the CS-8190N16 and enjoy the benefits of advanced engineering and seamless operation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and space-saving design.

Power Supplies (V): 8.5/16

The wide range of power supply voltage options (8.5V to 16V) provides flexibility in various automotive applications.

No. of Terminals: 16

With 16 terminals, this product can accommodate multiple connections and functions, making it versatile for different automotive electronics.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into existing automotive systems and facilitates maintenance and troubleshooting.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C ensures the product's reliability and performance in harsh automotive environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the product can withstand extreme cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides reliable electrical connections and resistance to corrosion, ensuring long-term durability.

Terminal Position: DUAL

The dual terminal position allows for easy and secure mounting on the PCB, enhancing the product's stability and performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in a wide range of temperature environments typically found in automotive applications.

Maximum Supply Current (Isup): 125 mA

The maximum supply current of 125 mA allows the product to support various automotive functions without exceeding its power limitations.

Technology: BIPOLAR

The bipolar technology used in this product offers high switching speed and low power consumption, making it ideal for automotive ICs requiring efficient performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides strong mechanical support and easy soldering onto the PCB, ensuring reliable connections in automotive applications.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy placement and soldering on standard PCB layouts, improving the product's compatibility and ease of integration.

Technical Specifications

Automotive ICs CS-8190N16 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

8.5/16

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

125 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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