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TJA1020TD-T

NXP Semiconductors

TJA1020TD-T by NXP Semiconductors

TJA1020TD-T by NXP Semiconductors is an automotive IC designed for robust communication. It operates on power supplies of 5/27V, features a compact 8-terminal gull-wing package, and supports surface mounting. Ideal for automotive applications requiring reliable data transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,341 parts In-Stock

1+ parts

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4,341

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Vyrian

USA . 3,075 parts In-Stock

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3,075

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Anansix

USA . 1,137 parts In-Stock

1+ parts

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1,137

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 567 parts In-Stock

1+ parts

$7.500

100+ parts

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567

$7.500

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UNI Independent Distributors

Spain . 4,687 parts In-Stock

1+ parts

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4,687

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Corphita

USA . 2,819 parts In-Stock

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2,819

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Overview

Elevate your automotive designs with the TJA1020TD-T from NXP Semiconductors, a trusted leader in innovation and quality. This advanced automotive IC ensures reliable communication in challenging environments, making it perfect for essential applications like vehicle networks and safety systems. Experience superior performance, durable construction, and versatile integration—all backed by NXP's commitment to excellence. Choose TJA1020TD-T to drive your projects toward success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for automotive applications where reliability is crucial.

Surface Mount: YES

Surface mount capability allows for efficient use of circuit board space and simplifies the assembly process, improving overall production efficiency.

Package Shape: RECTANGULAR

A rectangular package shape provides a standardized footprint that enhances the design flexibility of PCBs and maximizes component density.

Power Supplies (V): 5/27

The versatility in power supply range (5V to 27V) makes this IC suitable for a wide range of automotive applications, accommodating various system voltage levels.

No. of Terminals: 8

Having 8 terminals offers sufficient connectivity options while maintaining a compact design, ensuring both functionality and ease of integration into circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a reduced overall component size, ideal for space-constrained automotive environments.

Terminal Position: DUAL

Dual terminal position enhances the placement flexibility on PCBs and aids in better routing of signals, which is particularly beneficial in complex automotive systems.

Terminal Form: GULL WING

Gull wing terminals offer superior soldering and mechanical reliability, essential for automotive applications where vibrations and thermal stress are common.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for high-density mounting and ensures compatibility with a wide variety of PCB designs, promoting design versatility.

Technical Specifications

Automotive ICs TJA1020TD-T attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/27

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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