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UJA1079TW/3V3,118

NXP Semiconductors

UJA1079TW/3V3,118 by NXP Semiconductors

UJA1079TW/3V3,118 by NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a 32-terminal gull-wing package and operates on power supplies from 4.5V to 28V. Ideal for automotive applications, it ensures reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,738 parts In-Stock

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Digiode

USA . 2,703 parts In-Stock

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Anansix

USA . 1,244 parts In-Stock

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Microchip USA

USA . 177 parts In-Stock

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$2.830

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One Stop Electronics

USA . 1,194 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 1,114 parts In-Stock

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$16.990

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UNI Independent Distributors

Spain . 1,237 parts In-Stock

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Corphita

USA . 409 parts In-Stock

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Overview

Elevate your automotive designs with the UJA1079TW/3V3,118 from NXP Semiconductors, a leader in innovation and quality. This robust IC is engineered for reliability in extreme conditions, ensuring optimal performance from -40 °C to 125 °C. Its compact design and advanced features make it perfect for modern vehicles, enhancing safety and efficiency. Trust NXP to deliver not just products, but pioneering solutions that drive your success on the road.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount technology enables compact design and easier integration into circuit boards, maximizing space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating the layout of other components around it.

Power Supplies (V): 4.5/28

Supports a wide voltage range, making it versatile for various automotive power supply systems.

No. of Terminals: 32

A higher number of terminals provides more connectivity options, accommodating complex functions in automotive applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch of the package allow for a compact design, which is essential in space-constrained automotive environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in demanding automotive conditions.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures guarantees functionality even in extreme weather conditions, crucial for automotive reliability.

Terminal Position: DUAL

Dual terminal positioning enhances circuit stability and provides flexibility in PCB design.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, this grade ensures that the IC meets stringent reliability and performance standards.

Maximum Supply Current (Isup): 10 mA

Low supply current improves energy efficiency, which is beneficial for battery-operated systems in vehicles.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve mechanical strength, enhancing reliability in automotive environments.

Terminal Pitch: 0.635 mm

The precise terminal pitch allows for tighter integration and supports high-density packaging, essential for modern automotive designs.

Technical Specifications

Automotive ICs UJA1079TW/3V3,118 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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