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TLE7258LEXUMA1

Infineon Technologies

TLE7258LEXUMA1 by Infineon Technologies

TLE7258LEXUMA1 by Infineon is an Automotive IC with 5.5/18V power supplies, 8 terminals, and BICMOS technology. It comes in a small outline package and is surface mountable. Ideal for automotive applications requiring low supply current of 3mA.

Median Price

$0.656

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 5,000 parts In-Stock

1+ parts

$0.582

100+ parts

$0.327

1k+ parts

$0.263

10k+ parts

$0.216

5,000

$0.582

$0.327

$0.263

$0.216

Newark

USA . 5,000 parts In-Stock

1+ parts

$0.656

100+ parts

$0.351

1k+ parts

$0.281

10k+ parts

-

5,000

$0.656

$0.351

$0.281

-

Mouser Electronics

USA . 2,391 parts In-Stock

1+ parts

$1.820

100+ parts

$0.855

1k+ parts

$0.593

10k+ parts

$0.509

2,391

$1.820

$0.855

$0.593

$0.509

Element14

Singapore . 6,526 parts In-Stock

1+ parts

$1.920

100+ parts

$1.030

1k+ parts

$0.740

10k+ parts

$0.632

6,526

$1.920

$1.030

$0.740

$0.632

Rochester

USA . 10,089 parts In-Stock

1+ parts

-

100+ parts

$0.625

1k+ parts

$0.519

10k+ parts

$0.463

10,089

-

$0.625

$0.519

$0.463

DigiKey

USA . 10,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.780

10k+ parts

-

10,089

-

-

$0.780

-

Verical

USA . 4,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.649

10k+ parts

$0.579

4,477

-

-

$0.649

$0.579

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 965 parts In-Stock

1+ parts

$0.491

100+ parts

-

1k+ parts

-

10k+ parts

-

965

$0.491

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.852

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.852

-

-

-

Rutronik

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.460

5,000

-

-

-

$0.460

Vyrian

USA . 2,266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,266

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,921 parts In-Stock

1+ parts

$0.439

100+ parts

$0.428

1k+ parts

$0.426

10k+ parts

-

2,921

$0.439

$0.428

$0.426

-

Ampacity Inc.

Singapore . 1,897 parts In-Stock

1+ parts

$0.439

100+ parts

-

1k+ parts

-

10k+ parts

-

1,897

$0.439

-

-

-

Corphita

USA . 783 parts In-Stock

1+ parts

$0.465

100+ parts

-

1k+ parts

-

10k+ parts

-

783

$0.465

-

-

-

Modulus Dynamics

Lithuania . 5,844 parts In-Stock

1+ parts

$0.730

100+ parts

$0.701

1k+ parts

$0.672

10k+ parts

-

5,844

$0.730

$0.701

$0.672

-

Corohmni

South Africa . 350 parts In-Stock

1+ parts

$0.730

100+ parts

-

1k+ parts

-

10k+ parts

-

350

$0.730

-

-

-

Argo Parts USA

USA . 3,068 parts In-Stock

1+ parts

$0.851

100+ parts

-

1k+ parts

-

10k+ parts

-

3,068

$0.851

-

-

-

Continental Prestige Electronics

USA . 322 parts In-Stock

1+ parts

$0.851

100+ parts

-

1k+ parts

-

10k+ parts

$0.834

322

$0.851

-

-

$0.834

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.852

100+ parts

$0.835

1k+ parts

-

10k+ parts

-

1,000

$0.852

$0.835

-

-

Microchip USA

USA . 1,929 parts In-Stock

1+ parts

$5.535

100+ parts

-

1k+ parts

-

10k+ parts

-

1,929

$5.535

-

-

-

Aztec Data Supply Inc.

USA . 313 parts In-Stock

1+ parts

$8.330

100+ parts

-

1k+ parts

-

10k+ parts

-

313

$8.330

-

-

-

RC Electronics

USA . 66,192 parts In-Stock

1+ parts

-

100+ parts

$0.870

1k+ parts

$0.790

10k+ parts

$0.770

66,192

-

$0.870

$0.790

$0.770

Perfect Parts

USA . 22,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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22,400

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-

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iodParts Technologies Inc.

India . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20,000

-

-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,000

-

-

-

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Lixinc

USA . 9,357 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,357

-

-

-

-

Overview

Elevate your automotive applications with the TLE7258LEXUMA1 from Infineon Technologies. Crafted with precision and reliability in mind, this Automotive IC boasts a robust package body material that ensures durability and longevity. With its small outline package shape and surface mount capability, this IC offers seamless integration into various systems. Experience the seamless power supplies ranging from 5.5 to 18V, providing optimal performance. Trust in the quality and expertise of Infineon Technologies to bring value and innovation to your projects with the TLE7258LEXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, making it a reliable choice for automotive applications.

Surface Mount: YES

The surface mount design allows for easy and efficient installation on circuit boards, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard mounting practices, ensuring easy integration into existing automotive systems.

Power Supplies (V): 5.5/18

With a wide range of power supply voltages supported, this product can be used in various automotive applications without the need for additional voltage regulation.

No. of Terminals: 8

The 8 terminals provide ample connectivity options for interfacing with other components, enhancing the versatility of this automotive IC.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact automotive designs where size is a critical consideration.

Terminal Finish: TIN

The tin terminal finish offers excellent solderability and corrosion resistance, ensuring a reliable electrical connection in automotive environments.

Terminal Position: DUAL

The dual terminal position allows for flexibility in the orientation of the IC, accommodating different layout requirements in automotive systems.

Maximum Supply Current (Isup): 3 mA

With a low maximum supply current requirement, this product helps reduce power consumption in automotive applications, contributing to energy efficiency.

Technology: BICMOS

The BiCMOS technology used in this IC combines the benefits of both bipolar and CMOS technologies, providing high-performance operation and low power consumption for automotive systems.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination, making this IC environmentally friendly and compliant with RoHS regulations.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch offers high density packaging, allowing for more efficient use of board space in automotive electronics assemblies.

Moisture Sensitivity Level (MSL): 2A

The moisture sensitivity level rating of 2A indicates that this product has a moderate level of moisture resistance, suitable for automotive applications where exposure to humidity may occur.

Technical Specifications

Automotive ICs TLE7258LEXUMA1 attributes and parameters. Explore more Automotive ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2A

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5.5/18

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

3 mA

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TLE7258LEXUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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