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RBO40-40

STMicroelectronics

RBO40-40 by STMicroelectronics

STMicroelectronics RBO40-40 is an Automotive IC with 3 terminals, operating from -40 to 150 °C. It features PLASTIC/EPOXY body material, Tin/Lead finish, and a terminal pitch of 2.54mm. Ideal for automotive applications requiring high-temperature performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,975 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,975

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-

-

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Digiode

USA . 831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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831

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-

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Anansix

USA . 749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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749

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 247 parts In-Stock

1+ parts

$1.882

100+ parts

-

1k+ parts

$1.694

10k+ parts

-

247

$1.882

-

$1.694

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MKK Technologies

India . 1,571 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

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1,571

$3.540

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-

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DigiPath Technology Company

USA . 1,571 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

-

1,571

$3.540

-

-

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Corphita

USA . 2,949 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,949

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-

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Parana Technologies

USA . 954 parts In-Stock

1+ parts

-

100+ parts

$2.251

1k+ parts

-

10k+ parts

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954

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$2.251

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-

Overview

Discover the reliability and innovation of the RBO40-40 by STMicroelectronics, a top-quality automotive IC that delivers exceptional performance in a compact package. With STMicroelectronics' proven track record for excellence, this IC is designed to meet the demands of automotive applications with ease. From its durable plastic/epoxy body to its wide temperature range, this product ensures optimal functionality in any environment. Trust in STMicroelectronics to provide you with a cutting-edge solution that exceeds expectations, delivering value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures that the IC is lightweight and durable, making it suitable for automotive applications where weight and reliability are important factors.

No. of Terminals: 3

Having only 3 terminals simplifies the installation process and reduces the chances of errors during connection, making it user-friendly for automotive technicians.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures that the IC can withstand harsh automotive environments without overheating, providing reliable performance in extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the IC to function effectively even in cold weather conditions, making it suitable for use in automotive applications worldwide.

Terminal Finish: Tin/Lead (Sn/Pb)

The use of tin/lead terminal finish ensures good solderability and reliable electrical connections, enhancing the overall quality and longevity of the IC.

Temperature Grade: AUTOMOTIVE

Being designed specifically for automotive applications, the IC is built to meet stringent automotive industry standards for temperature resistance and reliability, ensuring dependable performance in vehicles.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for easy interfacing with other components or PCBs, making the IC versatile and compatible with various automotive electronic systems.

Technical Specifications

Automotive ICs RBO40-40 attributes and parameters. Explore more Automotive ICs devices from STMicroelectronics

Specs

JESD-609 Code:

e0

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.1TB

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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