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CS-452TH

Onsemi

CS-452TH by Onsemi

CS-452TH by Onsemi is an Automotive IC with 12V supply voltage. It features a rectangular package style with 5 terminals in zig-zag position. Ideal for automotive applications requiring reliable performance and durability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,379 parts In-Stock

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2,379

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Digiode

USA . 1,759 parts In-Stock

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1,759

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Distributors (Availability)

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Kulean Microsystems

USA . 6,712 parts In-Stock

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6,712

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TANS Electronics

Latvia . 2,840 parts In-Stock

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2,840

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Problanco Electronics

Mexico . 2,278 parts In-Stock

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2,278

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Corphita

USA . 972 parts In-Stock

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972

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UHIMA Technologies

Türkiye . 812 parts In-Stock

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812

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SupplyDigital Components

Austria . 462 parts In-Stock

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462

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Native Components

USA . 440 parts In-Stock

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440

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Corohmni

South Africa . 307 parts In-Stock

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Northwest PG Solutions

USA . 47 parts In-Stock

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Overview

Experience top-notch quality and performance with the CS-452TH by Onsemi, a leading manufacturer in the automotive IC industry. This innovative product offers unmatched reliability and versatility, making it perfect for a wide range of applications. Enhance your automotive systems with ease using this compact, efficient solution that provides exceptional value and benefits to customers. Trust Onsemi to deliver excellence in every aspect with the CS-452TH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product robust and easy to handle.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V ensures compatibility with standard automotive electrical systems.

No. of Terminals: 5

Having 5 terminals allows for multiple connections and flexibility in the circuit design.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability, ensuring reliable connections during installation.

Terminal Pitch: 1.7 mm

With a terminal pitch of 1.7mm, the product offers precise and compact circuit integration.

Technical Specifications

Automotive ICs CS-452TH attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PZIP-T5

JESD-609 Code:

e0

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP5H,.15,.7,67TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.7 mm

Terminal Position:

ZIG-ZAG

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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