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UJA1079ATW/3V3WD,1

NXP Semiconductors

UJA1079ATW/3V3WD,1 by NXP Semiconductors

UJA1079ATW/3V3WD,1 from NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a 32-terminal gull-wing design and operates on power supplies b/w 4.5V and 28V. Ideal for automotive applications, it ensures reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 15,000 parts In-Stock

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15,000

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Vyrian

USA . 5,110 parts In-Stock

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5,110

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Anansix

USA . 2,760 parts In-Stock

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2,760

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Digiode

USA . 2,288 parts In-Stock

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2,288

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Distributors (Availability)

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Microchip USA

USA . 2,624 parts In-Stock

1+ parts

$1.000

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2,624

$1.000

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One Stop Electronics

USA . 430 parts In-Stock

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$6.500

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430

$6.500

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AZTECH Wire

Italy . 263 parts In-Stock

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$16.280

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263

$16.280

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Infinite Electronics LLP (Excess)

. 15,005 parts In-Stock

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15,005

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UNI Independent Distributors

Spain . 8,341 parts In-Stock

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8,341

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Corphita

USA . 2,068 parts In-Stock

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2,068

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Overview

Elevate your automotive designs with the UJA1079ATW/3V3WD by NXP Semiconductors—where innovation meets reliability. Designed to thrive in extreme conditions, this high-quality automotive IC delivers exceptional performance and efficiency for a wide range of applications, from advanced driver assistance systems to connectivity solutions. Trust in NXP's expertise for unmatched durability, ensuring your vehicles run smoothly and safely while maximizing value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount capability allows for higher density circuit designs, resulting in reduced size and weight for automotive electronic systems.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of board space, enabling compact designs in automotive circuitry.

Power Supplies (V): 4.5/28

Wide operational voltage range (4.5V to 28V) enhances versatility, accommodating various automotive electrical systems.

No. of Terminals: 32

With 32 terminals, this IC can connect multiple components simultaneously, making it ideal for complex automotive applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile contribute to space-saving designs, crucial in today's compact automotive environments.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in harsh automotive conditions, reducing the risk of failure.

Minimum Operating Temperature: -40 °C

The IC's ability to operate at -40 °C makes it suitable for diverse environments, whether in extreme cold or heat.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and increases design flexibility for engineers.

Temperature Grade: AUTOMOTIVE

The automotive grade certification indicates compliance with industry standards, ensuring robustness and reliability in vehicles.

Maximum Supply Current (Isup): 10 mA

A low supply current of 10 mA helps in minimizing power consumption, which is critical in energy-efficient automotive designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance mechanical stability, ensuring a reliable connection in automotive applications.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm supports higher packing density, allowing for more compact circuit designs in automotive systems.

Technical Specifications

Automotive ICs UJA1079ATW/3V3WD,1 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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