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NCV7462DQ0G

Onsemi

NCV7462DQ0G by Onsemi

NCV7462DQ0G by Onsemi is an AEC-Q100 compliant automotive IC with 36 terminals in a small outline package. It operates on power supplies of 5-28V, with a max supply current of 10mA. Ideal for automotive applications requiring high reliability and performance under harsh conditions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,782 parts In-Stock

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1,782

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Digiode

USA . 729 parts In-Stock

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729

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Problanco Electronics

Mexico . 6,938 parts In-Stock

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6,938

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TANS Electronics

Latvia . 6,022 parts In-Stock

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6,022

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Kulean Microsystems

USA . 4,672 parts In-Stock

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4,672

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SupplyDigital Components

Austria . 3,771 parts In-Stock

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3,771

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Corphita

USA . 2,419 parts In-Stock

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Corohmni

South Africa . 478 parts In-Stock

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478

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UHIMA Technologies

Türkiye . 81 parts In-Stock

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Overview

Enhance your automotive designs with the NCV7462DQ0G by Onsemi. This high-quality Automotive IC offers reliability, efficiency, and performance that exceeds industry standards. Manufactured by Onsemi, a trusted leader in semiconductor technology, this product is AEC-Q100 qualified, ensuring durability and longevity. Ideal for a wide range of automotive applications, the NCV7462DQ0G provides unparalleled value, benefits, and advantages to customers seeking cutting-edge solutions for their projects. Experience innovation at its finest with Onsemi's NCV7462DQ0G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making the product reliable for automotive applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design in automotive electronics.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, meeting automotive industry requirements.

Package Shape: RECTANGULAR

Rectangular shape offers versatility and compatibility with various automotive IC designs.

Power Supplies (V): 5/28

Support for 5V to 28V power supplies enables flexibility and compatibility with different automotive systems.

No. of Terminals: 36

Increased number of terminals allows for more connections and functionalities in automotive applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space and improves thermal performance in automotive environments.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel gold palladium finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

Dual terminal position ensures secure connections and enhances electrical conductivity in automotive systems.

Maximum Time At Peak Reflow Temperature (s): 30

30-second maximum time at peak reflow temperature ensures efficient soldering and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures proper soldering and reliability in automotive ICs.

Maximum Supply Current (Isup): 10 mA

Low maximum supply current of 10mA helps in power efficiency and reduces energy consumption in automotive electronics.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and dependable electrical connections in automotive applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density integration and compact design in automotive ICs.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates high reliability and resistance to moisture-related issues in automotive environments.

Technical Specifications

Automotive ICs NCV7462DQ0G attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G36

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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