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UJA1076TW/3V3/WD,1

NXP Semiconductors

UJA1076TW/3V3/WD,1 by NXP Semiconductors

UJA1076TW/3V3/WD,1 from NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a compact 32-terminal package and operates on power supplies b/w 4.5V and 28V. Ideal for automotive applications, it ensures reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,757 parts In-Stock

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Digiode

USA . 3,270 parts In-Stock

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Anansix

USA . 959 parts In-Stock

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Microchip USA

USA . 569 parts In-Stock

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$3.444

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569

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One Stop Electronics

USA . 719 parts In-Stock

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$6.500

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719

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AZTECH Wire

Italy . 703 parts In-Stock

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$18.900

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QUARKTWIN TECHNOLOGY LTD

USA . 20,086 parts In-Stock

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UNI Independent Distributors

Spain . 8,070 parts In-Stock

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Corphita

USA . 3,841 parts In-Stock

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Overview

Elevate your automotive innovations with the UJA1076TW/3V3/WD,1 from NXP Semiconductors. Renowned for their commitment to quality and reliability, NXP delivers this high-performance IC tailored for demanding automotive applications. With its robust temperature range and compact design, it ensures seamless integration and long-lasting performance, empowering engineers to create safer, smarter vehicles. Experience unparalleled efficiency and reliability—choose NXP for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures excellent reliability and longevity, making it suitable for automotive applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient assembly processes, optimizing space in automotive electronics.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for layout flexibility on circuit boards, facilitating better space utilization.

Power Supplies (V): 4.5/28

Wide operating voltage range enhances the versatility of the IC, accommodating various automotive power systems.

No. of Terminals: 32

With 32 terminals, this IC provides ample connectivity options for complex automotive systems, allowing for more functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it ideal for space-constrained designs, particularly in modern automotive applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliable performance in extreme conditions typically faced in automotive environments.

Minimum Operating Temperature: -40 °C

Low temperature tolerance guarantees functionality even in harsh cold conditions, vital for automotive reliability.

Terminal Position: DUAL

Dual terminal positioning allows for better layout configurations and integration into various PCB designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive-grade standards, this IC guarantees high reliability and performance in automotive applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering capability and reliability, ensuring stable connections on PCBs.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm enables more compact designs while maintaining ease of handling during assembly.

Technical Specifications

Automotive ICs UJA1076TW/3V3/WD,1 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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