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UJA1079ATW/3V3,118

NXP Semiconductors

UJA1079ATW/3V3,118 by NXP Semiconductors

UJA1079ATW/3V3,118 by NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a 32-terminal gull-wing package and operates on power supplies from 4.5V to 28V. Ideal for automotive applications, it ensures reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,470 parts In-Stock

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3,470

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Anansix

USA . 2,137 parts In-Stock

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Digiode

USA . 1,504 parts In-Stock

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One Stop Electronics

USA . 1,628 parts In-Stock

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$2.500

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AZTECH Wire

Italy . 912 parts In-Stock

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$10.760

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912

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Microchip USA

USA . 3,820 parts In-Stock

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$16.115

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3,820

$16.115

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Component Stockers USA

USA . 4,191 parts In-Stock

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$16.570

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4,191

$16.570

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UNI Independent Distributors

Spain . 3,204 parts In-Stock

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Corphita

USA . 2,710 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Unlock the future of automotive innovation with the UJA1079ATW/3V3,118 from NXP Semiconductors. Designed for reliability and performance, this cutting-edge IC excels in demanding environments, making it perfect for advanced vehicle applications. With its robust thermal capabilities and compact design, it ensures seamless integration and efficiency. Trust in NXP's legacy of excellence to enhance your automotive solutions and drive your projects forward with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures good durability and resistance to environmental factors, making this IC suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, which is crucial in automotive electronics.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space on the PCB and enhances the integration of multiple components in tight layouts.

Power Supplies (V): 4.5/28

The wide power supply range accommodates various automotive systems, ensuring compatibility with different voltage levels.

No. of Terminals: 32

Having 32 terminals increases the connectivity options, allowing for more functionality and integration into complex automotive systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile help save space and reduce weight in automotive applications, contributing to overall vehicle efficiency.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature indicates robustness and reliability under extreme conditions commonly found in automotive environments.

Minimum Operating Temperature: -40 °C

This low minimum operating temperature allows the IC to function effectively in severe cold climates, expanding its usability.

Terminal Position: DUAL

Dual terminal positioning enhances the mounting flexibility on PCBs, making it easier to integrate into various designs.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature ensures compatibility with lead-free soldering processes, which are commonly used in automotive manufacturing.

Temperature Grade: AUTOMOTIVE

Being rated for automotive temperature conditions guarantees reliable performance and longevity in automotive applications.

Maximum Supply Current (Isup): 10 mA

A maximum supply current of 10 mA ensures efficient power consumption, which is vital for battery-operated automotive systems.

Terminal Form: GULL WING

Gull wing terminals allow for better mechanical stress distribution and easier handling during manufacturing and assembly.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm is suitable for high-density applications, which are often needed in modern automotive designs.

Technical Specifications

Automotive ICs UJA1079ATW/3V3,118 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UJA1079ATW/3V3,118 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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