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UJA1076TW/5V0,112

NXP Semiconductors

UJA1076TW/5V0,112 by NXP Semiconductors

UJA1076TW/5V0,112 by NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a dual terminal design with 32 terminals and operates on power supplies from 4.5V to 28V. Ideal for automotive applications, it ensures reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,064 parts In-Stock

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Digiode

USA . 3,488 parts In-Stock

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Anansix

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One Stop Electronics

USA . 946 parts In-Stock

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$1.500

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AZTECH Wire

Italy . 556 parts In-Stock

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$17.530

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Microchip USA

USA . 3,563 parts In-Stock

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Corphita

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QUARKTWIN TECHNOLOGY LTD

USA . 2,698 parts In-Stock

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UNI Independent Distributors

Spain . 728 parts In-Stock

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Overview

Unlock the power of innovation with the UJA1076TW/5V0,112 from NXP Semiconductors. Designed specifically for automotive applications, this cutting-edge IC offers unparalleled reliability and performance in extreme conditions, ensuring your vehicles run smoothly and efficiently. With NXP's proven expertise in quality and safety, transform your designs and elevate the driving experience while enjoying reduced development time and enhanced system integration benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures robustness and durability, making it suitable for various automotive applications.

Surface Mount: YES

Surface mount capability allows for compact design and efficient use of PCB space, facilitating easier integration into modern automotive systems.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for versatile layouts and configurations in automotive applications.

Power Supplies (V): 4.5/28

With a wide operating voltage range, this IC can efficiently handle varying power supply conditions typical in automotive environments.

No. of Terminals: 32

The 32 terminals provide ample connectivity options, enabling complex functionalities and multiple interface connections necessary in automotive designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save precious board space while accommodating modern compact automotive design requirements.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliability and performance in high-temperature automotive environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is well-suited for extreme cold conditions that automotive components may face.

Terminal Position: DUAL

Dual terminal positioning aids in simplified layout and reduced signal integrity issues, enhancing overall performance.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, this IC meets stringent automotive industry standards for reliability and safety.

Terminal Form: GULL WING

The gull wing terminal form provides excellent mechanical strength and solderability, ensuring robust connections in automotive electronics.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for high density and efficient use of space on the PCB, essential for modern automotive circuit designs.

Technical Specifications

Automotive ICs UJA1076TW/5V0,112 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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