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UJA1079TW/3V3,112

NXP Semiconductors

UJA1079TW/3V3,112 by NXP Semiconductors

UJA1079TW/3V3,112 by NXP Semiconductors is an automotive IC designed for robust performance in harsh environments. It operates b/w -40 °C to 125 °C with a supply voltage of 4.5-28V and features a compact 32-terminal gull-wing package. Ideal for automotive applications, it ensures reliable communication and control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,956 parts In-Stock

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Digiode

USA . 4,666 parts In-Stock

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Anansix

USA . 1,416 parts In-Stock

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One Stop Electronics

USA . 227 parts In-Stock

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$1.500

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Microchip USA

USA . 301 parts In-Stock

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$3.096

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AZTECH Wire

Italy . 179 parts In-Stock

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$11.500

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QUARKTWIN TECHNOLOGY LTD

USA . 15,472 parts In-Stock

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Corphita

USA . 3,949 parts In-Stock

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UNI Independent Distributors

Spain . 1,754 parts In-Stock

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Overview

Elevate your automotive designs with the UJA1079TW/3V3,112 from NXP Semiconductors, a leader in innovative automotive IC solutions. This high-quality component ensures reliable performance even in extreme temperatures, making it perfect for critical applications. With its compact design and robust power supply range, you can enhance efficiency while reducing space. Trust in NXP’s industry expertise to deliver unparalleled value and performance for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance against environmental factors, making this IC suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern automotive circuit boards, saving space and enhancing performance.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on PCBs, allowing for optimized layouts and layout flexibility.

Power Supplies (V): 4.5/28

A wide input voltage range (4.5V to 28V) enables compatibility with various automotive systems, ensuring reliability across different applications.

No. of Terminals: 32

With 32 terminals, the IC offers versatile connectivity options, accommodating complex functions needed in advanced automotive systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline make it suitable for space-constrained applications in modern vehicles, allowing for high-density designs.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures that the IC can function reliably in the demanding thermal environments of automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C makes this IC suitable for extreme temperature conditions, enhancing its reliability in various weather scenarios.

Terminal Position: DUAL

Dual terminal positioning facilitates easy soldering and improves the mechanical stability of the IC, which is crucial in automotive environments.

Temperature Grade: AUTOMOTIVE

Designated for automotive use, this temperature grade confirms the IC's suitability for harsh automotive environments, ensuring a long lifespan.

Maximum Supply Current (Isup): 10 mA

A low supply current of 10 mA contributes to energy efficiency, making this IC ideal for battery-powered applications or energy-sensitive designs.

Terminal Form: GULL WING

Gull wing terminals offer excellent solderability and mechanical strength, which enhances the reliability of the IC in automotive assembly processes.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm is standard for surface mount technologies, ensuring compatibility with a wide range of manufacturing processes and designs.

Technical Specifications

Automotive ICs UJA1079TW/3V3,112 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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