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CS-8312D8

Onsemi

CS-8312D8 by Onsemi

CS-8312D8 by Onsemi is an Automotive IC with 8 terminals, operating from -40 to 125 °C. It has a power supply of 7/10V and max current of 15mA. Ideal for automotive applications due to its small outline package and bipolar technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,399 parts In-Stock

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Digiode

USA . 1,192 parts In-Stock

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TANS Electronics

Latvia . 6,833 parts In-Stock

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6,833

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Problanco Electronics

Mexico . 4,527 parts In-Stock

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SupplyDigital Components

Austria . 4,320 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Kulean Microsystems

USA . 2,001 parts In-Stock

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Northwest PG Solutions

USA . 1,809 parts In-Stock

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UHIMA Technologies

Türkiye . 339 parts In-Stock

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Corphita

USA . 233 parts In-Stock

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Native Components

USA . 201 parts In-Stock

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Corohmni

South Africa . 185 parts In-Stock

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Overview

Unleash the power of innovation with the CS-8312D8 by Onsemi. As a leading manufacturer in the automotive ICs category, Onsemi delivers superior quality and reliability in every product. Designed for efficiency and performance, this small outline package offers customers unparalleled value and benefits. Whether you're looking to enhance your vehicle's electronics or improve overall functionality, the CS-8312D8 is the perfect solution. Experience the advantages of cutting-edge technology with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection to the IC, making it suitable for automotive applications where reliability is key.

Surface Mount: YES

Surface mount design makes installation easier and more efficient, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular shape allows for easier placement and mounting in the PCB layout, optimizing space usage.

Power Supplies (V): 7/10

Offering multiple voltage options provides flexibility in power requirements, catering to different automotive systems.

No. of Terminals: 8

Having a sufficient number of terminals allows for effective connectivity and signal transmission within the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, enabling compact and efficient designs for automotive electronics.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability and performance under harsh automotive conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range enables the IC to function in cold environments, ensuring consistent operation in varied conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead finish provides good solderability and conductivity for reliable electrical connections in automotive applications.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved reliability in connecting the IC to the circuit.

Temperature Grade: AUTOMOTIVE

Designed and tested to meet automotive standards, ensuring durability and performance in automotive environments.

Maximum Supply Current (Isup): 15 mA

Low maximum supply current helps in efficient power usage and minimizes energy consumption.

Technology: BIPOLAR

Bipolar technology offers high-speed switching and robust performance, suitable for automotive control and communication systems.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and good contact reliability, ensuring long-term stability in automotive applications.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for compact layout and high-density integration, optimizing PCB space and enabling complex automotive electronics.

Technical Specifications

Automotive ICs CS-8312D8 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

7/10

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

15 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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