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UJA1076TW/3V3,112

NXP Semiconductors

UJA1076TW/3V3,112 by NXP Semiconductors

UJA1076TW/3V3,112 by NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a 32-terminal gull-wing design and operates on power supplies from 4.5V to 28V. Ideal for automotive applications, it ensures reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,100 parts In-Stock

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Digiode

USA . 3,638 parts In-Stock

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Anansix

USA . 622 parts In-Stock

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622

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Microchip USA

USA . 355 parts In-Stock

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$1.000

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One Stop Electronics

USA . 1,089 parts In-Stock

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$1.500

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$1.500

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AZTECH Wire

Italy . 746 parts In-Stock

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$14.540

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UNI Independent Distributors

Spain . 5,916 parts In-Stock

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Corphita

USA . 1,493 parts In-Stock

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Overview

Elevate your automotive innovations with the UJA1076TW/3V3,112 from NXP Semiconductors. Renowned for cutting-edge technology and reliability, NXP delivers a powerful solution that thrives in extreme conditions, ensuring safety and efficiency. This robust IC enhances communication systems, paving the way for smart vehicle integration. Experience unparalleled performance, backed by a trusted manufacturer, and empower your designs with advanced features that offer long-lasting value and unmatched benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures excellent durability and resistance to environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly, providing versatility in automotive designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the printed circuit board, making integration into tight spaces easier within the automotive environment.

Power Supplies (V): 4.5/28

Wide voltage range supports various automotive electrical systems, enhancing compatibility with diverse vehicle platforms.

No. of Terminals: 32

A higher number of terminals facilitates multiple connections and functionalities, enabling complex automotive systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for a compact footprint, essential for modern automotive components with space constraints.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliability in the demanding environments often encountered in automotive applications.

Minimum Operating Temperature: -40 °C

This low temperature capability makes the product suitable for a wide range of climates, ensuring consistent performance in extreme conditions.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in layout design, making it easier to route traces on the PCB.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, this temperature grade guarantees reliability and performance in vehicles.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical strength, ensuring robust connections in automotive environments.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm fits well with standard PCB design practices, facilitating easier integration into existing designs.

Technical Specifications

Automotive ICs UJA1076TW/3V3,112 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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