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UJA1076ATW/3V3,118

NXP Semiconductors

UJA1076ATW/3V3,118 by NXP Semiconductors

UJA1076ATW/3V3,118 by NXP Semiconductors is an automotive IC designed for robust performance with a supply voltage range of 4.5-28V. It features a dual terminal configuration and operates in extreme temperatures from -40 °C to 125 °C. Ideal for automotive applications, it ensures reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,254 parts In-Stock

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8,254

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Digiode

USA . 4,386 parts In-Stock

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4,386

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Anansix

USA . 1,684 parts In-Stock

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1,684

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Bristol Electronics

USA . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,418 parts In-Stock

1+ parts

$5.500

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1,418

$5.500

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AZTECH Wire

Italy . 89 parts In-Stock

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$13.640

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89

$13.640

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Microchip USA

USA . 4,769 parts In-Stock

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$16.112

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4,769

$16.112

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Corphita

USA . 4,179 parts In-Stock

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4,179

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QUARKTWIN TECHNOLOGY LTD

USA . 3,463 parts In-Stock

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3,463

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UNI Independent Distributors

Spain . 2,388 parts In-Stock

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2,388

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Overview

Enhance your automotive designs with the UJA1076ATW/3V3,118 from NXP Semiconductors, a leader in innovative solutions. This high-quality automotive IC offers unmatched reliability and performance across extreme temperatures, ensuring your applications run smoothly under any conditions. With its compact design and advanced features, benefit from improved efficiency and lower power consumption, making it an ideal choice for modern vehicles. Trust NXP to power your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to harsh automotive environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape is conducive for efficient layout and integration within various automotive applications.

Power Supplies (V): 4.5/28

This wide operating voltage range makes the product versatile for a variety of automotive systems.

No. of Terminals: 32

With 32 terminals, this IC can support complex functions and connectivity requirements in automotive applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline help conserve board space, advantageous for space-constrained automotive designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating ensures reliability and performance in extreme automotive conditions.

Minimum Operating Temperature: -40 °C

This low minimum operating temperature guarantees functionality in frigid conditions encountered in many automotive applications.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout and integration with existing designs.

Peak Reflow Temperature °C: 260

The ability to withstand high peak reflow temperatures makes this IC suitable for various soldering processes.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive temperature specifications ensures reliability and compliance with industry standards.

Maximum Supply Current (Isup): 0.097 mA

The low maximum supply current contributes to energy efficiency, making it an ideal choice for power-sensitive automotive applications.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and mechanical strength, ensuring robust connections.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm supports high-density designs and facilitates easier PCB layout.

Technical Specifications

Automotive ICs UJA1076ATW/3V3,118 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

.097 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UJA1076ATW/3V3,118 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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