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UJA1079TW/3V3/WD,1

NXP Semiconductors

UJA1079TW/3V3/WD,1 by NXP Semiconductors

UJA1079TW/3V3/WD,1 from NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a compact 32-terminal package and operates on power supplies b/w 4.5V and 28V. Ideal for automotive applications, it ensures reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,618 parts In-Stock

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Anansix

USA . 2,020 parts In-Stock

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Digiode

USA . 1,635 parts In-Stock

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One Stop Electronics

USA . 1,370 parts In-Stock

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$2.500

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Microchip USA

USA . 582 parts In-Stock

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$2.956

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582

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AZTECH Wire

Italy . 895 parts In-Stock

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$21.800

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895

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Corphita

USA . 2,089 parts In-Stock

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UNI Independent Distributors

Spain . 135 parts In-Stock

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Overview

Elevate your automotive innovations with the UJA1079TW/3V3/WD,1 from NXP Semiconductors. Renowned for quality and reliability, NXP ensures that this advanced automotive IC is engineered to withstand extreme temperatures, making it perfect for diverse applications. Experience seamless integration, enhanced performance, and reduced design complexity, empowering your projects to thrive in today’s competitive landscape. Choose NXP for superior solutions that drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for automated assembly, leading to reduced manufacturing costs and increased reliability in automotive circuits.

Package Shape: RECTANGULAR

A rectangular package shape is efficient for layout on printed circuit boards, optimizing space and enhancing performance.

Power Supplies (V): 4.5/28

The wide voltage range provides flexibility for use in various automotive electrical systems, accommodating multiple power supply configurations.

No. of Terminals: 32

With 32 terminals, this IC offers extensive connectivity options for complex automotive functions, enabling advanced features in vehicles.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline and thin profile help reduce weight and space requirements in automotive designs, contributing to overall vehicle efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance under extreme conditions typical in automotive environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this IC suitable for harsh climates, ensuring functionality in all weather conditions.

Terminal Position: DUAL

Dual terminal position enhances the ease of layout and thermal management on circuit boards, thus improving performance and reliability.

Temperature Grade: AUTOMOTIVE

Being graded for automotive use signifies compliance with industry-specific standards, ensuring safety and reliability in critical applications.

Maximum Supply Current (Isup): 10 mA

A low maximum supply current promotes energy efficiency, making it ideal for battery-operated automotive systems.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering accessibility, ensuring robust connections and facilitating ease of assembly in automotive applications.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for dense packing of components, enabling more compact and efficient automotive designs.

Technical Specifications

Automotive ICs UJA1079TW/3V3/WD,1 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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