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CS-3341D14

Onsemi

CS-3341D14 by Onsemi

CS-3341D14 by Onsemi is an Automotive IC with 14 terminals in a small outline package. It operates b/w -40 to 125 °C, with power supplies of 9/17V. This bipolar technology device has a max supply current of 25mA and is ideal for automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,199 parts In-Stock

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Vyrian

USA . 1,738 parts In-Stock

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Northwest PG Solutions

USA . 1,385 parts In-Stock

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$3.481

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Problanco Electronics

Mexico . 8,033 parts In-Stock

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TANS Electronics

Latvia . 7,325 parts In-Stock

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SupplyDigital Components

Austria . 6,779 parts In-Stock

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Kulean Microsystems

USA . 2,833 parts In-Stock

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Corphita

USA . 1,803 parts In-Stock

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Native Components

USA . 605 parts In-Stock

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Corohmni

South Africa . 349 parts In-Stock

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UHIMA Technologies

Türkiye . 70 parts In-Stock

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Overview

Elevate the performance of your automotive applications with the CS-3341D14 by Onsemi. Manufactured with precision and quality in mind, this Automotive IC offers unparalleled reliability and efficiency. Its advanced technology and durable construction make it the perfect choice for a wide range of automotive systems. With a compact package style and dual terminal position, this IC is designed to optimize space and streamline installation. Experience the value and benefits of superior performance with the CS-3341D14 - the ultimate solution for your automotive electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material is lightweight and durable, making it ideal for automotive applications where reliability is crucial.

Surface Mount: YES

Surface mount technology allows for efficient assembly and space-saving on PCBs, making the product suitable for modern car electronics design.

Power Supplies (V): 9/17

The product can operate within a wide voltage range of 9V to 17V, providing flexibility in power supply options for automotive systems.

No. of Terminals: 14

Having 14 terminals allows for multiple connections and functionalities, enabling the IC to perform various tasks within the car's electronics system.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space requirements on the PCB, making it suitable for compact automotive electronics designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance under harsh automotive environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the IC to function effectively in cold weather conditions frequently encountered in automotive environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and electrical conductivity, ensuring robust connections in automotive electronics applications.

Temperature Grade: AUTOMOTIVE

Being designed for automotive temperature grades, the IC can withstand the extreme temperature fluctuations experienced in vehicles without performance degradation.

Maximum Supply Current (Isup): 25 mA

The low maximum supply current requirement of 25mA helps in reducing power consumption and thermal stress on the IC, enhancing its longevity in automotive systems.

Technology: BIPOLAR

Bipolar technology offers high speed and precise signal processing capabilities, making the IC suitable for demanding automotive applications that require quick and accurate data processing.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mounting on PCBs and enhances mechanical strength, ensuring reliable connections in automotive electronics assemblies.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for high-density mounting on the PCB, contributing to compact automotive electronics designs with efficient use of space.

Technical Specifications

Automotive ICs CS-3341D14 attributes and parameters. Explore more Automotive ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9/17

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

25 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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