Loading...

UJA1079ATW/3V3,112

NXP Semiconductors

UJA1079ATW/3V3,112 by NXP Semiconductors

UJA1079ATW/3V3,112 by NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a 32-terminal gull-wing package and operates on power supplies from 4.5V to 28V. Ideal for automotive applications, it ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,625

-

-

-

-

Vyrian

USA . 4,147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,147

-

-

-

-

Anansix

USA . 2,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,450

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,238 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,238

$3.500

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$5.602

100+ parts

$5.546

1k+ parts

$5.322

10k+ parts

-

1,000

$5.602

$5.546

$5.322

-

Microchip USA

USA . 2,180 parts In-Stock

1+ parts

$7.174

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

$7.174

-

-

-

AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$17.590

100+ parts

-

1k+ parts

-

10k+ parts

-

874

$17.590

-

-

-

UNI Independent Distributors

Spain . 4,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,729

-

-

-

-

Corphita

USA . 4,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,592

-

-

-

-

Overview

Elevate your automotive design with the UJA1079ATW/3V3,112 from NXP Semiconductors—a name synonymous with innovation and reliability. This high-quality automotive IC seamlessly integrates into your applications, delivering exceptional performance across a wide temperature range. With its sleek surface mount design and robust construction, it ensures durability in demanding environments. Trust NXP to drive efficiency and enhance functionality in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures a lightweight and durable package, essential for automotive applications where reliability is crucial.

Surface Mount: YES

Surface mount technology allows for a more compact design, enabling efficient use of space on PCB layouts, which is advantageous in automotive electronics.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout and integration into a variety of automotive systems, providing flexibility in design.

Power Supplies (V): 4.5/28

This wide range of power supply voltages makes the IC versatile for various automotive applications, accommodating different operational requirements.

No. of Terminals: 32

With 32 terminals, this IC provides ample connectivity options, allowing for complex functionalities necessary in modern automotive systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this IC suitable for space-constrained designs, fitting well in compact automotive environments.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures that this IC can function reliably in the high-temperature conditions often found in automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C allows for performance in extreme cold conditions, making this IC ideal for diverse climates and environments.

Terminal Position: DUAL

Dual terminal positioning facilitates easier PCB layout and assembly, improving manufacturing efficiency.

Temperature Grade: AUTOMOTIVE

Being rated for automotive temperatures guarantees that this IC meets strict automotive standards, ensuring reliability and safety in vehicles.

Maximum Supply Current (Isup): 10 mA

With a maximum supply current of 10 mA, this IC is energy-efficient, contributing to lower power consumption in automotive applications.

Terminal Form: GULL WING

Gull wing terminals provide a secure mechanical connection and ease of soldering, enhancing reliability during assembly.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for high-density PCB designs, maximizing the use of available space in automotive electronics.

Technical Specifications

Automotive ICs UJA1079ATW/3V3,112 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20