Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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82S129/BFA by NXP Semiconductors is a military-grade OTP ROM with a 256x4 organization and operates asynchronously. It features a ceramic, metal-sealed flatpack package, supporting a supply voltage of 4.5-5.5V and max access time of 60ns. Ideal for reliable data storage in harsh environments, it withstands temperatures from -55 °C to 125 °C.
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$167.707
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Corphita
This robust package material enhances reliability and durability, making it suitable for harsh environments.
The surface-mount capability allows for compact designs and efficient use of PCB space.
The rectangular shape optimizes layout possibilities on printed circuit boards.
Asynchronous operation allows for quicker system response and easy integration into existing circuits.
Standard 5 V operation ensures compatibility with a wide range of electronic devices.
With 16 terminals, it enables connection to multiple data lines, enhancing data transfer capabilities.
Flatpack style facilitates easier mounting on PCBs, ensuring a low profile.
The high operating temperature range ensures reliability in demanding thermal conditions.
This organization format allows for flexible and efficient data storage structures.
3-state output improves versatility in control signal management, beneficial for bus applications.
The capability to operate at low temperatures suits military and aerospace applications.
Dual terminal positioning enhances the ease of soldering and reduces assembly time.
The low profile design allows for more compact system designs without compromising performance.
A compact width supports space-constrained applications while still maintaining performance.
This lower threshold voltage provides flexibility in power supply design.
MIL-STD grade ensures the component can withstand extreme conditions, perfect for defense applications.
Bipolar technology promotes high speed and low power consumption, advantageous for various applications.
Parallel communication enables faster data transfer rates, optimizing overall system performance.
Flat terminals simplify the mounting process and enhance connectivity reliability.
A 256-word capacity provides adequate storage for many applications, balancing performance and density.
The 4-bit memory width facilitates efficient data handling and integration into larger systems.
This terminal pitch supports compatibility with standard PCB designs and assembly processes.
Offers sufficient word codes for a variety of applications while maintaining simplicity and efficiency.
The maximum supply voltage allows for some flexibility in power supply design to accommodate variance.
With a memory density of 1024 bits, this OTP ROM can store significant data, ideal for numerous applications.
As an OTP ROM, this component provides one-time programmable memory suitable for secure data storage.
The fast access time ensures rapid data retrieval, enhancing system performance.
OTP ROM 82S129/BFA attributes and parameters. Explore more OTP ROM devices from NXP Semiconductors
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JESD-30 Code:
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No. of Words:
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Organization:
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Package Style (Meter):
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Qualification:
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Maximum Supply Voltage (Vsup):
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Nominal Supply Voltage / Vsup (V):
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82S129/BFA Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
ABS06-32.768KHZ-T
Abracon
Abracon's ABS06-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 90000 ohm series resistance, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing in compact designs like IoT devices and wearables.
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
LL4148
First Components International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358N
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
1N4148WT
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Sensitron Semiconductor
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
KSZ9031RNXIC
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
5962-8765102LA
Cypress Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
SNC54186J
Texas Instruments
SNC54186J by Texas Instruments is a MIL-STD-883 Class B OTP ROM IC with 64x8 organization, TTL technology, and -55 to 125°C operating temperature range. Ideal for military applications requiring reliable memory storage in harsh environments.
TBP24S81-55NP3
TBP24S81-55NP3 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 55 ns max access time. It operates b/w 0 to 70 °C, ideal for commercial applications requiring reliable non-volatile memory storage in a rectangular package style.
DS2505P+
Maxim Integrated
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TBP28L86ANW
TBP28L86ANW by Texas Instruments is a 1KX8 OTP ROM with 8192 bit memory density. Operating at 5V, it has an access time of 110ns and operates in parallel mode. This rectangular package with 24 terminals is ideal for commercial applications requiring non-volatile memory storage.
CY27C256A-45ZC
CY27C256A-45ZC by Rochester Electronics is a 262144-bit OTP ROM with 32KX8 organization and 45 ns access time. Operating at 5V, it offers 32768 words of memory in a small outline package for commercial applications requiring fast parallel data retrieval.
27LV256-25/P
27LV256-25/P by Microchip Technology is a 32KX8 OTP ROM with 262144 bit memory density. It operates at 5V, has an access time of 250ns, and features a 3-STATE output. Commonly used in commercial applications, this device offers parallel input/output type and through-hole terminal form for easy integration into various systems.
AT27C256R-70JU
Atmel
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
TBP18SA46JP4
TBP18SA46JP4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates b/w 0-70°C, has a max access time of 75ns, and consumes up to 155mA. Ideal for commercial applications requiring reliable non-volatile memory in a ceramic rectangular package with dual terminals.
CBP28L22MJ
CBP28L22MJ by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 256x8 organization, 2048-bit memory density, and 75ns access time. Ideal for military applications due to its MILITARY temperature grade and CERAMIC package material. Operates b/w -55°C to 125°C, making it suitable for rugged environments.
TBP24SA10MJ
TBP24SA10MJ by Texas Instruments is a 256x4 OTP ROM with 1024-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in parallel mode. Ideal for military-grade applications requiring fast and reliable non-volatile memory storage.
SNC54S474J
SNC54S474J by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 512x8 organization and 4096-bit memory density. Operating b/w -55°C to 125°C, it has a max access time of 85ns. Ideal for military applications requiring reliable data storage in harsh environments.
SN54S474J
SN54S474J by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 85ns and MILITARY temperature grade. This TTL technology IC is ideal for applications requiring fast non-volatile memory storage in harsh environments.
SN74186J
SN74186J by Texas Instruments is a 64x8 OTP ROM with 75ns access time. Operating b/w 0-70°C, it has a max supply current of 120mA. This TTL technology IC in ceramic package is ideal for commercial applications requiring fast memory access.
AT27LV512A-90JU
AT27LV512A-90JU by Microchip is a 64KX8 OTP ROM with 3.3V nominal voltage, 85°C max temp, and 90 ns access time. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact chip carrier package.
TBP24S10JP4
TBP24S10JP4 by Texas Instruments is a 256x4 OTP ROM IC with 1024-bit memory density. It operates at 5V, has a max access time of 55ns, and supports TTL technology. This rectangular ceramic package with 16 terminals is ideal for commercial applications requiring reliable non-volatile memory storage.
M27W101-80K6TR
STMicroelectronics
STMicroelectronics M27W101-80K6TR is an OTP ROM with 128KX8 organization, 131072 words, and 1048576 bit memory density. It operates in asynchronous mode with a max access time of 80 ns. Commonly used in industrial applications due to its CMOS technology and 3-STATE output characteristics.
SN74S476N3
SN74S476N3 by Texas Instruments is a 1KX4 OTP ROM with 4096-bit memory density. Operating at 5V, it has 18 terminals in an IN-LINE package style. Ideal for commercial applications, this TTL technology device has a temperature range of 0-70°C.
TBP24S10J4
TBP24S10J4 by Texas Instruments is a 256x4 OTP ROM with 1024-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 55ns. This IC, housed in a ceramic rectangular package, is ideal for commercial applications requiring reliable non-volatile memory storage.
JBP24SA41MJ
JBP24SA41MJ by Texas Instruments is a MILITARY-grade OTP ROM with 1KX4 organization, 4096-bit memory density, and 75ns max access time. It operates b/w -55 to 125 °C, making it ideal for high-reliability applications in harsh environments requiring fast data retrieval.
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82S123/BEA
Philips Components
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; Memory Width: 8; Minimum Supply Voltage (Vsup): 4.5 V;
82S123BEA
Qp Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel; Maximum Supply Voltage (Vsup): 5.5 V;
Teledyne E2v (Uk)
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; JESD-30 Code: R-CDIP-T16; Minimum Supply Voltage (Vsup): 4.5 V;
NXP Semiconductors
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 32;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T16;
82S129A/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Length: 19.535 mm;
82S129A/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
82S129/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
82S115/BKA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
82S123B/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 32X8;
82S126/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
82S123/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
82S123A/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Organization: 32X8;
82S123B/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
82S126A/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
82S115/BJA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Width: 15.24 mm;
82S123A/BEA
82S126A/BFA
82S126/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; No. of Words: 256 words; Surface Mount: NO;
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