Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
82S126A/BEA by NXP Semiconductors is a military-grade OTP ROM with a 5V supply, featuring a 256x4 organization and max access time of 35 ns. Its ceramic, glass-sealed package ensures durability in harsh environments. Ideal for asynchronous applications requiring reliable data storage.
Median Price
$182.390
Lifecycle Status
Suppliers In-Stock
4
In-Stock Inventory
1k+
Arrow
1+ parts
100+ parts
$95.750
1k+ parts
-
10k+ parts
Digiode
$275.490
Vyrian
Anansix
Northwest PG Solutions
$3.278
Corphita
$260.991
UNI Independent Distributors
Native Components
$2.891
RTC Component Inc.
The ceramic and glass-sealed package material offers excellent durability and resistance to environmental factors, making this product reliable in harsh conditions.
The rectangular shape is conducive to efficient PCB layout and integration, making it easier to use in various electronic designs.
Operating asynchronously allows for simpler design architecture and can lead to reduced total system power consumption in applications requiring flexibility.
The nominal supply voltage of 5 V is standard in many digital circuits, ensuring compatibility with a wide range of applications.
With 16 terminals, this product allows for versatile interfacing options in various circuit designs.
The in-line package style is ideal for mounting on PCBs, simplifying the assembly process and ensuring effective space utilization.
A maximum operating temperature of 125 °C ensures reliable performance in high-temperature environments, making it suitable for industrial applications.
The 256x4 organization provides efficient data storage and retrieval, which is advantageous for applications requiring quick access.
Open-collector output allows for wired-AND logic, enabling the integration of multiple chips on the same output line, enhancing design flexibility.
The ability to operate in low temperatures (-55 °C) makes this device suitable for extreme environments, such as aerospace or military applications.
Dual terminal position allows for versatile placement and can facilitate easy routing in multi-layer circuit boards.
The compact height allows for space-efficient designs, critical in applications with limited PCB real estate.
A moderate width facilitates easy integration into various layouts and designs, ensuring compatibility with existing systems.
The minimum supply voltage of 4.5 V allows for operation in low-power applications, providing flexibility in power-sensitive designs.
With its precise length, this component can fit well within circuit designs, ensuring robust connections without excessive protrusion.
The military temperature grade indicates high reliability and performance in demanding applications, making it suitable for critical systems.
Bipolar technology provides high-speed operation and reliability, enhancing performance in various electronic applications.
Parallel access allows for faster data retrieval, essential for applications requiring high-speed memory access.
Through-hole terminals provide robust mechanical strength and easier handling during assembly, enhancing overall product reliability.
With 256 words available, it is adequate for many applications where moderate memory needs are required.
A memory width of 4 bits allows for efficient storage of data while keeping the component compact, suitable for many serial communications.
A standard terminal pitch of 2.54 mm is compatible with a wide range of PCB layouts, facilitating easy design integration.
This specification indicates consistent storage capabilities, ensuring that the memory integrates well within application-specific designs.
The ability to support a maximum supply voltage of 5.5 V ensures the device can handle slight voltage variations, enhancing reliability.
A memory density of 1024 bits allows for efficient data storage, providing enough capacity for various applications without waste.
As a One-Time Programmable ROM, this device offers a secure and permanent data storage solution, ideal for applications requiring fixed data.
With a maximum access time of 35 ns, this product promises quick data retrieval, making it suitable for applications demanding speed.
OTP ROM 82S126A/BEA attributes and parameters. Explore more OTP ROM devices from NXP Semiconductors
Maximum Access Time:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Qualification:
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
82S126A/BEA Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
Daco Semiconductor
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
BAV99
Kingwell Technonlogy
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358MX
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM317D2TG
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
Formosa Microsemi
5962-01-167-3240
Texas Instruments' 5962-01-167-3240 is a 512x8 OTP ROM with 4096-bit memory density. It operates at 5V, has a max access time of 75ns, and supports TTL technology. Ideal for commercial applications requiring non-volatile memory storage in a rectangular package style.
5962-01-129-0025
Texas Instruments' 5962-01-129-0025 is a MILITARY-grade OTP ROM with 256x8 organization, 2048-bit memory density, and 80ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
CY27C512-45JC
Cypress Semiconductor
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
5962-01-135-8054
Texas Instruments' 5962-01-135-8054 is a 1KX4 OTP ROM with 4096-bit memory density. Operating at 5V, it offers a max access time of 60ns and operates in commercial temperature grades. This rectangular ceramic package with 18 terminals is ideal for applications requiring reliable non-volatile memory storage in TTL technology.
TBP28L45NP1
TBP28L45NP1 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 60ns max access time. It operates at a nominal voltage of 5V, suitable for commercial temperature grades. This rectangular package with 24 terminals in an in-line style is ideal for applications requiring reliable non-volatile memory storage.
SN74S470NP1
SN74S470NP1 by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grades. This rectangular package with 20 terminals is ideal for applications requiring TTL technology and through-hole terminal form.
CMS212-250
Texas Instruments' CMS212-250 is a 256KX16 OTP ROM with 60 terminals and operates at 5V. It features a CMOS technology, 3-STATE output, and parallel interface. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.
DS2502S+
Analog Devices
DS2502S+ by Analog Devices is an OTP ROM with 1024-bit memory density, operating at 5V. It features a serial interface, 128x8 organization, and industrial temperature grade. Commonly used in applications requiring non-volatile memory storage with a small outline package style.
SN74S474NP3
SN74S474NP3 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 75ns. This IC, housed in a rectangular plastic/epoxy package, is ideal for commercial applications requiring reliable non-volatile memory storage.
SNC54S188J
SNC54S188J by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 32x8 organization, TTL technology, and 50ns max access time. It operates b/w -55°C to 125°C, has a supply voltage of 5V, and consumes up to 110mA. Ideal for military applications requiring reliable memory storage in harsh environments.
DS2505+
Maxim Integrated
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Operating Mode: ASYNCHRONOUS;
5962-01-214-2169
Texas Instruments' 5962-01-214-2169 is a MILITARY-grade OTP ROM with 512x8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
M27C1001-15C1
M27C1001-15C1 by STMicroelectronics is a 128KX8 OTP ROM with a memory density of 1048576 bit. It operates asynchronously and has a max access time of 150 ns. This chip is commonly used in applications that require non-volatile memory storage.
DS2502X1
DS2502X1 by Maxim Integrated is a 1024-bit OTP ROM with 128x8 organization. Operating at 5V, it has a max access time of 15000ns and operates in asynchronous mode. Commonly used in industrial applications due to its very thin profile grid array package style.
AT27C080-90JU-T
AT27C080-90JU-T by Microchip Technology is a 1MX8 OTP ROM with 1048576 words and 8388608 bit memory density. It operates at 5V with a max access time of 90ns, suitable for applications requiring fast and reliable non-volatile memory storage in various electronic devices.
TBP24SA81-55JP4
TBP24SA81-55JP4 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 55ns max access time. It features a rectangular ceramic package with 18 terminals in-line, suitable for commercial-grade TTL technology applications.
SN74S474N1
SN74S474N1 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at 5V, has a max access time of 75ns, and consumes up to 155mA. This IC is ideal for commercial applications requiring non-volatile memory storage in a rectangular package style.
5962-8863603LA
Qp Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;
5962-01-186-0376
Texas Instruments' 5962-01-186-0376 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
AT27C512R-70PC
Atmel
AT27C512R-70PC by Atmel is a 64KX8 OTP ROM with 70ns access time, operating at 5V. It features a 3-STATE output and operates in parallel mode. Commonly used in commercial applications requiring non-volatile memory storage with a memory density of 524288 bits.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
82S123/BEA
Philips Components
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; Memory Width: 8; Minimum Supply Voltage (Vsup): 4.5 V;
82S123BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel; Maximum Supply Voltage (Vsup): 5.5 V;
Teledyne E2v (Uk)
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; JESD-30 Code: R-CDIP-T16; Minimum Supply Voltage (Vsup): 4.5 V;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 32;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T16;
82S129A/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Length: 19.535 mm;
82S129A/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
82S129/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
82S115/BKA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
82S123B/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 32X8;
82S129/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
82S126/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
82S123/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
82S123A/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Organization: 32X8;
82S123B/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
82S115/BJA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Width: 15.24 mm;
82S123A/BEA
82S126A/BFA
82S126/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
82S126A/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Technology: TTL;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved