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82S126A/BEA

NXP Semiconductors

82S126A/BEA by NXP Semiconductors

82S126A/BEA by NXP Semiconductors is a military-grade OTP ROM with a 5V supply, featuring a 256x4 organization and max access time of 35 ns. Its ceramic, glass-sealed package ensures durability in harsh environments. Ideal for asynchronous applications requiring reliable data storage.

Median Price

$182.390

Lifecycle Status

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4

In-Stock Inventory

1k+

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Arrow

USA . 135 parts In-Stock

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$182.390

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$95.750

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Digiode

USA . 3,738 parts In-Stock

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$275.490

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Vyrian

USA . 6,177 parts In-Stock

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Anansix

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Northwest PG Solutions

USA . 84 parts In-Stock

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$3.278

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Corphita

USA . 3,191 parts In-Stock

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$260.991

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UNI Independent Distributors

Spain . 5,264 parts In-Stock

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Native Components

USA . 449 parts In-Stock

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$2.891

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RTC Component Inc.

USA . 40 parts In-Stock

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Overview

Unlock new possibilities with the 82S126A/BEA from NXP Semiconductors, a top-tier OTP ROM designed for reliability in demanding applications. Housed in a robust ceramic package and engineered for extreme temperatures, this memory solution excels where quality matters most. Ideal for military and aerospace sectors, it offers unmatched durability and performance, ensuring your systems run smoothly under pressure, delivering peace of mind and value to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package material offers excellent durability and resistance to environmental factors, making this product reliable in harsh conditions.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient PCB layout and integration, making it easier to use in various electronic designs.

Operating Mode: ASYNCHRONOUS

Operating asynchronously allows for simpler design architecture and can lead to reduced total system power consumption in applications requiring flexibility.

Nominal Supply Voltage / Vsup: 5 V

The nominal supply voltage of 5 V is standard in many digital circuits, ensuring compatibility with a wide range of applications.

No. of Terminals: 16

With 16 terminals, this product allows for versatile interfacing options in various circuit designs.

Package Style (Meter): IN-LINE

The in-line package style is ideal for mounting on PCBs, simplifying the assembly process and ensuring effective space utilization.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance in high-temperature environments, making it suitable for industrial applications.

Organization: 256X4

The 256x4 organization provides efficient data storage and retrieval, which is advantageous for applications requiring quick access.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for wired-AND logic, enabling the integration of multiple chips on the same output line, enhancing design flexibility.

Minimum Operating Temperature: -55 °C

The ability to operate in low temperatures (-55 °C) makes this device suitable for extreme environments, such as aerospace or military applications.

Terminal Position: DUAL

Dual terminal position allows for versatile placement and can facilitate easy routing in multi-layer circuit boards.

Maximum Seated Height: 5.08 mm

The compact height allows for space-efficient designs, critical in applications with limited PCB real estate.

Width: 7.62 mm

A moderate width facilitates easy integration into various layouts and designs, ensuring compatibility with existing systems.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V allows for operation in low-power applications, providing flexibility in power-sensitive designs.

Length: 19.535 mm

With its precise length, this component can fit well within circuit designs, ensuring robust connections without excessive protrusion.

Temperature Grade: MILITARY

The military temperature grade indicates high reliability and performance in demanding applications, making it suitable for critical systems.

Technology: BIPOLAR

Bipolar technology provides high-speed operation and reliability, enhancing performance in various electronic applications.

Parallel or Serial: PARALLEL

Parallel access allows for faster data retrieval, essential for applications requiring high-speed memory access.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical strength and easier handling during assembly, enhancing overall product reliability.

No. of Words: 256 words

With 256 words available, it is adequate for many applications where moderate memory needs are required.

Memory Width: 4 bits

A memory width of 4 bits allows for efficient storage of data while keeping the component compact, suitable for many serial communications.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm is compatible with a wide range of PCB layouts, facilitating easy design integration.

No. of Words Code: 256

This specification indicates consistent storage capabilities, ensuring that the memory integrates well within application-specific designs.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to support a maximum supply voltage of 5.5 V ensures the device can handle slight voltage variations, enhancing reliability.

Memory Density: 1024 bit

A memory density of 1024 bits allows for efficient data storage, providing enough capacity for various applications without waste.

Memory IC Type: OTP ROM

As a One-Time Programmable ROM, this device offers a secure and permanent data storage solution, ideal for applications requiring fixed data.

Maximum Access Time: 35 ns

With a maximum access time of 35 ns, this product promises quick data retrieval, making it suitable for applications demanding speed.

Technical Specifications

OTP ROM 82S126A/BEA attributes and parameters. Explore more OTP ROM devices from NXP Semiconductors

Specs

Maximum Access Time:

35 ns

JESD-30 Code:

R-GDIP-T16

Length:

19.535 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Terminals:

16

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

256X4

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

82S126A/BEA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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