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82S123/BFA

NXP Semiconductors

82S123/BFA by NXP Semiconductors

82S123/BFA by NXP Semiconductors is a military-grade OTP ROM with a 5V supply, featuring a 32x8 organization and max access time of 50 ns. Its ceramic, metal-sealed package ensures durability in harsh environments. Ideal for asynchronous applications requiring reliable data storage.

Median Price

$12.556

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Freelance Electronics

USA . 18 parts In-Stock

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$12.556

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$13.184

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$12.431

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Anansix

USA . 1,654 parts In-Stock

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Digiode

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Native Components

USA . 86 parts In-Stock

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Northwest PG Solutions

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One Stop Electronics

USA . 1,050 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Unlock unparalleled reliability and performance with the 82S123/BFA OTP ROM from NXP Semiconductors. Engineered for excellence, this high-quality memory solution is perfect for military and industrial applications, delivering robust data integrity in extreme conditions. Its compact design ensures easy integration while offering exceptional durability. Choose NXP for trusted innovation and elevate your projects with superior value and efficiency!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable material ensures reliability and protection against environmental factors, making it ideal for military and industrial applications.

Surface Mount: YES

The surface mount capability facilitates easier integration into compact electronic designs, saving board space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular shape is standard for many applications, allowing more straightforward design integration and flexibility in layout.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster access times since memory can be accessed directly without clock synchronization, increasing overall system performance.

Nominal Supply Voltage / Vsup: 5V

A nominal supply voltage of 5V makes it compatible with a wide range of digital circuits, simplifying power supply design.

No. of Terminals: 16

With 16 terminals, this chip is versatile and can connect to various systems while maintaining a compact footprint.

Package Style (Meter): FLATPACK

The flatpack style allows for efficient surface mounting and connections, which enhances reliability and performance in compact applications.

Maximum Operating Temperature: 125 °C

The high operational temperature tolerance ensures reliable performance even in extreme conditions, suitable for military-grade applications.

Organization: 32X8

This organization provides a balanced structure for data storage, allowing efficient use of available memory space with 32 words of 8 bits each.

Output Characteristics: 3-STATE

3-state output allows for better bus-sharing between multiple devices, enhancing flexibility in complex circuit designs.

Minimum Operating Temperature: -55 °C

The capability to operate in extremely low temperatures makes this OTP ROM suitable for aerospace, defense, and rugged environments.

Terminal Position: DUAL

Dual terminal positioning simplifies component layout and improves solder joint reliability in surface-mount applications.

Maximum Seated Height: 2.159 mm

A low seated height helps in creating slim profile designs, which is crucial for compact electronic products.

Width: 6.731 mm

This compact width allows for better placement options in tight circuit board designs, maximizing available space.

Minimum Supply Voltage (Vsup): 4.5V

Flexibility in supply voltage range from 4.5V makes it compatible with various applications, ensuring versatile usability.

Temperature Grade: MILITARY

MIL-SPEC rating ensures reliability and performance in critical military applications, making it a trusted component for defense electronics.

Technology: BIPOLAR

Bipolar technology offers faster switching speeds and better noise margins, enhancing performance in high-speed applications.

Parallel or Serial: PARALLEL

Parallel access allows for faster data retrieval and processing times, which is beneficial for real-time data applications.

Terminal Form: FLAT

Flat terminal form facilitates easier and more reliable soldering processes, which improves assembly quality.

No. of Words: 32 words

With 32 words of storage, it provides enough data handling capabilities for many embedded applications while still being compact.

Memory Width: 8

An 8-bit memory width aligns well with many popular microcontroller architectures, ensuring compatibility and ease of integration.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch provides a balance between density and manufacturability, making PCB design more straightforward.

No. of Words Code: 32

Consistency in the number of words and code helps simplify the design process, leading to quicker development cycles.

Maximum Supply Voltage (Vsup): 5.5V

The maximum supply voltage tolerance ensures stability and reliability under varying voltage conditions, ideal for sensitive applications.

Memory Density: 256 bit

A memory density of 256 bits offers a compact yet effective solution for data storage needs in consumer and industrial devices.

Memory IC Type: OTP ROM

As an OTP ROM, it is perfect for applications where data needs to be written once and remain secure, ideal for firmware storage.

Maximum Access Time: 50 ns

Fast access time of 50 ns enhances system performance, making it suitable for applications requiring quick data retrieval.

Technical Specifications

OTP ROM 82S123/BFA attributes and parameters. Explore more OTP ROM devices from NXP Semiconductors

Specs

Maximum Access Time:

50 ns

JESD-30 Code:

R-CDFP-F16

Memory Density:

256 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32X8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

2.159 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

FLAT

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.731 mm

Trade Compliance

82S123/BFA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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