Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 32;
Median Price
-
Lifecycle Status
Suppliers In-Stock
13
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Infinite Electronics LLP
VNN
Anansix
Nova Conductors
LWI Electronics Inc
Vyrian
Sinequanon
Electronic Expediters
Prism Electronics
Mil-Aero Solutions, Inc.
Resion
MISTER SPROCKETS
Corohmni
$4.050
One Stop Electronics
$16.000
Ampacity Inc.
$17.000
Argo Parts USA
Corphita
Authorized Procurement Solutions
Continental Prestige Electronics
Glotronic Ltd.
UNI Independent Distributors
Infinite Electronics LLP (Excess)
Aranea Global
Kepictronics
RTC Component Inc.
OTP ROM 82S123/BEA attributes and parameters. Explore more OTP ROM devices from NXP Semiconductors
Maximum Access Time:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Qualification:
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
82S123/BEA Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
ABS07-32.768KHZ-T
Abracon
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
LP2950CDT-3.3G
Onsemi
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Jiangsu Jiejie Microelectronics
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Dc Components
LM107H/883C
National Semiconductor
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
BQ2022ALPRE3
Texas Instruments
BQ2022ALPRE3 by Texas Instruments is an OTP ROM with 1024-bit memory density. It operates asynchronously at a max clock frequency of 0.01667 MHz and has a nominal voltage of 2.7V. This device, in a cylindrical package shape, is commonly used for applications requiring non-volatile memory storage with low power consumption.
ER5911/P
Microchip Technology
ER5911/P by Microchip Technology is an OTP ROM with 128x8 organization, 1024-bit memory density, and 10000 write/erase cycles. It operates at 5V, has a temperature range of 0-70°C, and features synchronous operation. Ideal for applications requiring reliable non-volatile memory storage in commercial-grade environments.
TBP18S22J
TBP18S22J by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring reliable non-volatile memory storage in TTL technology environments.
TBP28L166N1
TBP28L166N1 by Texas Instruments is a 2Kx8 OTP ROM memory IC with 16384-bit density. Operating at 5V, it has a temperature range of 0-70°C and comes in a 24-terminal IN-LINE package. Ideal for commercial applications requiring reliable non-volatile memory storage.
AT27C080-90PU
AT27C080-90PU by Microchip is a 1MX8 OTP ROM with 3-STATE output, operating at 5V. It has a max access time of 90ns and memory density of 8388608 bit. Commonly used in industrial applications for storing firmware due to its high reliability and parallel interface.
TBP24S81JP4
TBP24S81JP4 by Texas Instruments is a 2Kx4 OTP ROM with 8192-bit memory density and 70ns max access time. It operates b/w 0°C to 70°C, drawing a max supply current of 175mA. Ideal for commercial applications requiring reliable non-volatile memory storage in a ceramic rectangular package.
SN74S474J4
SN74S474J4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 75ns. This IC, housed in a ceramic rectangular package, is ideal for commercial applications requiring reliable non-volatile memory storage.
5962-01-158-9148
Texas Instruments' 5962-01-158-9148 is a MILITARY-grade OTP ROM with 1KX4 organization, 4096-bit memory density, and 75 ns max access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
AT27C256R-45JU
Atmel
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
SN74S475N
SN74S475N by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating b/w 0-70°C, it has a max access time of 75ns and consumes up to 155mA. Ideal for commercial applications, this TTL technology chip comes in a rectangular package with 24 terminals.
SN74188AN
SN74188AN by Texas Instruments is a 32X8 OTP ROM with 5V supply, 110mA max current. Operating b/w 0-70°C, it has a 50ns access time and memory width of 8. Ideal for commercial applications requiring TTL technology in an IN-LINE package style.
SN74S473J
SN74S473J by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring reliable non-volatile memory storage in a ceramic rectangular package with 20 terminals.
JBP38SA165MJT
JBP38SA165MJT by Texas Instruments is a MILITARY-grade OTP ROM with 2KX8 organization and 16384-bit memory density. Featuring a temperature range of -55 to 125 °C, it is ideal for applications requiring reliable non-volatile memory storage in harsh environments. With a package style of IN-LINE and 24 terminals, this TTL technology device offers high performance in compact designs.
SN74S2708N1
SN74S2708N1 by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density. It operates at temperatures from 0 to 70°C, with a max access time of 70ns. Ideal for commercial applications requiring reliable TTL technology in a rectangular package style.
5962-8863603LA
Teledyne E2v (uk)
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T24;
TBP24S41J
TBP24S41J by Texas Instruments is an OTP ROM memory IC with 1KX4 organization, 4096 bit memory density, and operates in parallel mode. It has a max access time of 60 ns and is suitable for applications requiring non-volatile memory storage in commercial temperature environments.
DS2502R+T&R
Analog Devices
Analog Devices' DS2502R+T&R is a 1024-bit OTP ROM with 128x8 organization. Operating at -40 to 85°C, it has a supply voltage range of 2.8-6V and max access time of 15000ns. Ideal for industrial applications requiring small outline, thin profile memory ICs in gull wing package style.
5962-01-050-6942
Texas Instruments' 5962-01-050-6942 is a 5V OTP ROM with 1KX4 organization, 4096-bit memory density, and 60ns max access time. Ideal for commercial applications requiring reliable non-volatile memory storage in a rectangular plastic/epoxy package with 18 terminals.
DS2406P/T&R
Maxim Integrated
DS2406P/T&R by Maxim Integrated is a 1Kx1 OTP ROM with 1024-bit memory density. Operating at 3V, it features a small outline package and industrial temperature grade. Suitable for applications requiring asynchronous operation and serial communication, it has a terminal pitch of 1.27mm and C-bend terminal form.
SN54188AW
SN54188AW by Texas Instruments is a 32x8 OTP ROM with 50ns access time, operating b/w -55 to 125°C. It has a supply voltage of 5V and max current draw of 110mA. Ideal for military-grade applications requiring fast memory access in a compact flatpack package.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
82S123/BEA
Philips Components
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; Memory Width: 8; Minimum Supply Voltage (Vsup): 4.5 V;
82S123BEA
Qp Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel; Maximum Supply Voltage (Vsup): 5.5 V;
Teledyne E2v (Uk)
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; JESD-30 Code: R-CDIP-T16; Minimum Supply Voltage (Vsup): 4.5 V;
Philips Semiconductors
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T16;
82S129A/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Length: 19.535 mm;
82S129A/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
82S129/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
82S115/BKA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
82S123B/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 32X8;
82S129/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
82S126/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
82S123/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
82S123A/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Organization: 32X8;
82S123B/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
82S126A/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
82S115/BJA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Width: 15.24 mm;
82S123A/BEA
82S126A/BFA
82S126/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, METAL-SEALED COFIRED; Maximum Supply Voltage (Vsup): 5.5 V;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved