Loading...

82S129A/BEA

NXP Semiconductors

82S129A/BEA by NXP Semiconductors

82S129A/BEA by NXP Semiconductors is a military-grade OTP ROM with a 5V supply, featuring a 256x4 organization and max access time of 35 ns. Its ceramic, glass-sealed package ensures durability in harsh environments. Ideal for applications requiring reliable data storage in compact designs.

Median Price

$40.586

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 3 parts In-Stock

1+ parts

$40.586

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$40.586

-

-

-

Anansix

USA . 1,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,503

-

-

-

-

Digiode

USA . 1,193 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,193

-

-

-

-

Vyrian

USA . 220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

220

-

-

-

-

Eagle Technology Solutions

USA . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14

-

-

-

-

Resion

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Beltway Electronics Company

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Electronics Depot

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 222 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

222

$8.000

-

-

-

Native Components

USA . 120 parts In-Stock

1+ parts

$934.990

100+ parts

$916.290

1k+ parts

$906.940

10k+ parts

$897.590

120

$934.990

$916.290

$906.940

$897.590

Northwest PG Solutions

USA . 1,621 parts In-Stock

1+ parts

$1,028.489

100+ parts

-

1k+ parts

-

10k+ parts

-

1,621

$1,028.489

-

-

-

Corphita

USA . 423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

423

-

-

-

-

UNI Independent Distributors

Spain . 204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

204

-

-

-

-

Overview

Unlock the potential of your designs with the 82S129A/BEA from NXP Semiconductors, a top-tier OTP ROM solution crafted for reliability and performance. With its robust ceramic, glass-sealed package, this memory chip excels in demanding environments, offering exceptional temperature tolerance. Perfect for military and industrial applications, it ensures data integrity while delivering speedy access times. Choose NXP for quality you can trust and elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials enhances the durability and reliability of the OTP ROM, making it suitable for harsh environments.

Package Shape: RECTANGULAR

The rectangular shape allows for compact design layouts, making it easier to integrate into various electronic systems.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode offers flexibility and faster response times in data retrieval, improving overall system performance.

Nominal Supply Voltage / Vsup: 5 V

The standard 5 V supply voltage ensures compatibility with most electronic systems, simplifying design and integration.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for versatile applications in electronic circuitry.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy mounting on PCBs, allowing for straightforward assembly in various electronic devices.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures (up to 125 °C) ensures reliability in demanding applications, such as automotive or industrial settings.

Organization: 256X4

This organization structure allows efficient data storage and retrieval, optimizing memory usage for specific applications.

Output Characteristics: 3-STATE

3-state output characteristics enable better control in multi-device interfacing, reducing the risk of data collisions in systems.

Minimum Operating Temperature: -55 °C

The wide temperature range (from -55 °C) ensures reliable operation in cold environments, making it suitable for military and aerospace applications.

Terminal Position: DUAL

Dual terminal positioning provides improved mounting options and flexibility in circuit designs.

Maximum Seated Height: 5.08 mm

A low seated height helps in designing compact circuit layouts, making it ideal for space-constrained applications.

Width: 7.62 mm

A width of 7.62 mm ensures that the component can fit easily within standard PCB layouts.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V enhances operational stability, allowing for operation even in slightly reduced voltage conditions.

Length: 19.535 mm

The specific length is designed to provide optimal fit and spacing on PCBs for various applications.

Temperature Grade: MILITARY

MILITARY temperature grading indicates the component's reliability under extreme conditions, making it ideal for defense and aerospace uses.

Technology: BIPOLAR

Bipolar technology allows for faster switching speeds and lower power consumption, improving efficiency in data processing.

Parallel or Serial: PARALLEL

Parallel memory access enables faster data transfer rates, making it suitable for high-performance applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are easier to solder, enhancing the assembly process.

No. of Words: 256 words

256 words of memory allows for adequate data storage for many applications, ensuring versatility.

Memory Width: 4

A memory width of 4 bits accommodates efficient data handling, making the product suitable for a variety of tasks.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard in many PCBs, facilitating straightforward integration into existing designs.

No. of Words Code: 256

With 256 words available, this memory chip offers sufficient coding capacity for different applications.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V ensures operational integrity even in conditions of voltage fluctuation.

Memory Density: 1024 bit

A memory density of 1024 bits provides substantial data storage in a compact form, ensuring efficient use of space.

Memory IC Type: OTP ROM

As an OTP ROM, it is suitable for applications where data needs to be permanently written during programming, ensuring data integrity.

Maximum Access Time: 35 ns

A maximum access time of 35 ns contributes to high-speed data access, optimizing overall application performance.

Technical Specifications

OTP ROM 82S129A/BEA attributes and parameters. Explore more OTP ROM devices from NXP Semiconductors

Specs

Maximum Access Time:

35 ns

JESD-30 Code:

R-GDIP-T16

Length:

19.535 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Terminals:

16

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

256X4

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

82S129A/BEA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20