Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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82S123B/BEA by NXP Semiconductors is a military-grade OTP ROM with a 5V supply, featuring a 32x8 organization and max access time of 30 ns. It operates asynchronously in a dual terminal, through-hole package. Ideal for reliable data storage in harsh environments.
Median Price
$25.024
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$0.085
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$0.094
$0.083
Ampacity Inc.
$27.000
One Stop Electronics
$30.000
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Corphita
The use of ceramic and glass-sealed materials provides durability and resistance to environmental factors, ensuring a longer lifespan for the OTP ROM.
A rectangular package shape is commonly used in various applications, making it compatible with standard PCB layouts.
Asynchronous operation allows for simpler integration into systems, enabling quicker design and shorter time-to-market.
A nominal operating voltage of 5 V makes this OTP ROM compatible with a wide range of digital circuits.
With 16 terminals, this OTP ROM offers sufficient connections for various applications without needing excessive space.
The in-line package style facilitates easy handling and assembly, enhancing manufacturability.
A maximum operating temperature of 125 °C indicates robustness for high-temperature environments, making it suitable for military applications.
The 32X8 organization provides a balanced structure, allowing efficient data storage and retrieval in the ROM.
3-state output characteristics allow for greater flexibility in interfacing with other digital circuits, reducing potential conflicts.
With a minimum operating temperature of -55 °C, this OTP ROM ensures functionality in extreme cold climates.
Dual terminal positions enhance the design's versatility, making it easier to adapt to different board layouts.
The compact seated height allows for efficient use of space on circuit boards, which is essential in compact designs.
A width of 7.62 mm strikes a good balance between size and performance, suitable for a wide range of devices.
The specified length allows for adequate spacing between other components while maintaining effective operation.
A military temperature grade ensures reliability and performance in demanding environments, making it ideal for defense applications.
Bipolar technology provides excellent speed and performance, making this OTP ROM suitable for fast-access applications.
Parallel access enables faster data retrieval, enhancing overall system efficiency.
Through-hole terminals provide strong mechanical support and are easier to solder, ensuring reliable connections in rugged environments.
With 32 words available, this OTP ROM offers adequate storage for small to medium-sized applications.
An 8-bit memory width allows for efficient data processing in 8-bit microcontroller systems.
A terminal pitch of 2.54 mm is standard and ensures compatibility with most PCB designs, simplifying the integration process.
Having 32 words code provides enough options for varied application requirements while keeping design simple.
The maximum supply voltage of 5.5 V ensures safe operation under various conditions and protects against over-voltage scenarios.
A memory density of 256 bits allows this OTP ROM to store essential data compactly, making it ideal for space-sensitive applications.
As an OTP ROM, it guarantees secure data storage that cannot be altered after programming, making it suitable for applications requiring data integrity.
A maximum access time of 30 ns allows for quick data retrieval, enhancing system performance in time-sensitive applications.
OTP ROM 82S123B/BEA attributes and parameters. Explore more OTP ROM devices from NXP Semiconductors
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82S123B/BEA Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
ROHM
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
New Jersey Semiconductor Products
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
TCA6424ARGJR
Texas Instruments
TCA6424ARGJR by Texas Instruments is a CMOS parallel I/O port with 24 bits and 3 ports. It operates b/w -40 to 85°C, suitable for industrial applications. With a max clock frequency of 0.4 MHz, it offers low power consumption at only 0.03 mA supply current.
1N4148WS
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Components
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
TBP18SA22NP3
TBP18SA22NP3 by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grades. This rectangular package with 20 terminals is ideal for applications requiring reliable non-volatile memory storage in TTL technology.
5962-01-083-3924
Texas Instruments' 5962-01-083-3924 is a MILITARY-grade OTP ROM with 512X8 organization, 4096 bit memory density, and 85 ns max access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for military applications requiring fast, reliable non-volatile memory storage.
M27C4001-10C1
STMicroelectronics
M27C4001-10C1 by STMicroelectronics is a 512Kx8 OTP ROM with 100ns access time, operating at 5V. It features a 3-STATE output and operates in asynchronous mode. Commonly used for memory storage applications due to its high memory density and parallel interface.
5962-01-228-7029
Texas Instruments' 5962-01-228-7029 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 75 ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
5962-01-143-5798
Advanced Micro Devices
5962-01-143-5798 by Advanced Micro Devices is an OTP ROM with 512x8 organization, MILITARY grade, and 70ns access time. It is used in applications requiring reliable memory storage in harsh environments.
M27C1001-35C6
STMicroelectronics M27C1001-35C6 is a 128Kx8 OTP ROM with 35 ns access time, operating at 5V. It features 3-STATE output and common I/O type, suitable for industrial applications requiring reliable non-volatile memory storage in a compact chip carrier package.
5962-01-087-6737
Texas Instruments' 5962-01-087-6737 is a 256x8 OTP ROM with memory density of 2048 bit. Operating at 5V, it has a max access time of 70ns and consumes up to 155mA. Ideal for commercial applications requiring reliable non-volatile memory in a rectangular package style with through-hole terminals.
TBP18S030N
TBP18S030N by Texas Instruments is a 256-bit OTP ROM with 32x8 organization, operating at 5V. It features an access time of 40ns and operates in parallel mode. This rectangular IC, with through-hole terminals, is ideal for commercial applications requiring non-volatile memory storage.
JBP24S81MJ
The Texas Instruments JBP24S81MJ is a MILITARY-grade OTP ROM with 2KX4 organization, 8192-bit memory density, and 85ns max access time. It operates b/w -55°C to 125°C, making it suitable for rugged environments requiring fast non-volatile memory storage in military applications.
SN74S476JP4
SN74S476JP4 by Texas Instruments is a 1KX4 OTP ROM IC with 4096-bit memory density. Operating at 5V, it has a temperature range of 0-70°C and uses TTL technology. This rectangular ceramic package with 18 terminals is ideal for commercial applications requiring non-volatile memory storage.
5962-01-170-6790
Texas Instruments' 5962-01-170-6790 is a 32X8 OTP ROM with 5V supply, 110mA max current, and 40ns access time. Ideal for commercial applications, this TTL technology chip has a rectangular plastic/epoxy package with 16 terminals in an in-line style.
5962-8851805LA
Defense Logistics Agency
Defense Logistics Agency's 5962-8851805LA is a MILITARY-grade OTP ROM with 512X8 organization, operating at -55 to 125 °C. It features CERAMIC package, SYNCHRONOUS mode, and 24 terminals for parallel connection. Ideal for secure data storage in harsh environments.
SN74S472NP1
SN74S472NP1 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in commercial temperature grade. This rectangular package IC with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
BQ2022ADBZRG4
BQ2022ADBZRG4 by Texas Instruments is an OTP ROM with 1KX1 organization, operating at 2.7V nominal voltage. It features a small outline package style and operates in serial mode. Ideal for applications requiring low power consumption and compact design in temperature-sensitive environments.
AT27C512R-70JU-T
Microchip Technology
AT27C512R-70JU-T by Microchip Technology is a 64KX8 OTP ROM with a memory density of 524288 bit. It operates at an asynchronous mode with a max access time of 70 ns. This chip, which has a rectangular shape and is surface mountable, is commonly used in industrial applications requiring non-volatile memory storage.
SNC54S475J
The Texas Instruments SNC54S475J is a MIL-STD-883 Class B OTP ROM with 512x8 organization and 4096-bit memory density. Operating b/w -55°C to 125°C, it has a max access time of 85ns. Ideal for military applications requiring reliable data storage in harsh environments.
JBP38S03X-30MFK
JBP38S03X-30MFK by Texas Instruments is a 32x8 OTP ROM chip carrier with 20 terminals. It operates at temperatures ranging from -55 to 125°C and has a max access time of 30ns. Ideal for military-grade applications requiring fast memory access in compact form factors.
JBP28LA22MJ
JBP28LA22MJ by Texas Instruments is a MILITARY-grade OTP ROM with 256x8 organization, 2048-bit memory density, and 80ns max access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
SN74S474JP4
SN74S474JP4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 75ns and consumes up to 155mA. This TTL technology chip in ceramic package is ideal for commercial applications requiring non-volatile memory storage.
CMS68P256-200
Texas Instruments' CMS68P256-200 is a 256KX8 OTP ROM with 3-STATE output, operating at 5V. It features a MICROELECTRONIC ASSEMBLY package and operates in ASYNCHRONOUS mode. Ideal for applications requiring fast access times and low standby current in commercial temperature grades.
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82S123/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; Memory Width: 8; Minimum Supply Voltage (Vsup): 4.5 V;
82S123BEA
Qp Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel; Maximum Supply Voltage (Vsup): 5.5 V;
Teledyne E2v (Uk)
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; JESD-30 Code: R-CDIP-T16; Minimum Supply Voltage (Vsup): 4.5 V;
NXP Semiconductors
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 32;
Philips Semiconductors
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T16;
82S129A/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Length: 19.535 mm;
82S129A/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
82S129/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
82S115/BKA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
82S129/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
82S126/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
82S123/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
82S123A/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Organization: 32X8;
82S123B/BFA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
82S126A/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
82S115/BJA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Width: 15.24 mm;
82S123A/BEA
82S126A/BFA
82S126/BEA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
82S123/BEX
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;
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