Loading...

82S123A/BFA

NXP Semiconductors

82S123A/BFA by NXP Semiconductors

82S123A/BFA by NXP Semiconductors is a military-grade OTP ROM with a 5V supply, featuring a 32x8 organization and max access time of 35 ns. Its ceramic, metal-sealed flatpack design ensures durability in harsh environments. Ideal for asynchronous applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,766

-

-

-

-

Anansix

USA . 1,334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,334

-

-

-

-

Vyrian

USA . 1,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,013

-

-

-

-

Mil-Aero Solutions, Inc.

USA . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 476 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

476

$1.000

-

-

-

UNI Independent Distributors

Spain . 8,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,045

-

-

-

-

Corphita

USA . 4,612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,612

-

-

-

-

Northwest PG Solutions

USA . 1,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,406

-

-

-

-

Native Components

USA . 363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

363

-

-

-

-

Overview

Unlock unparalleled reliability and performance with the 82S123A/BFA OTP ROM from NXP Semiconductors. Engineered for demanding applications, this robust memory solution excels in environments where quality and durability are paramount, thanks to its military-grade specifications. Experience seamless integration with a versatile design that supports various uses, ensuring you benefit from speed, efficiency, and long-term value. Elevate your projects with trusted expertise from an industry leader!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction ensures high reliability and protection against environmental stress, making it suitable for harsh conditions.

Surface Mount: YES

Surface mount capability allows for compact and efficient board designs, making it ideal for modern electronics where space is at a premium.

Package Shape: RECTANGULAR

The rectangular shape provides flexibility in layout design and is compatible with various PCB designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies integration and enhances performance for systems where timing is critical.

Nominal Supply Voltage / Vsup: 5 V

A standard supply voltage of 5V is widely used in many applications, ensuring easy compatibility with existing systems.

No. of Terminals: 16

With 16 terminals, it offers ample connections for data and control signals, facilitating a wide range of applications.

Package Style (Meter): FLATPACK

Flatpack style minimizes the height of the component, allowing for low-profile designs and better fitting into compact systems.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in high-temperature environments, making it suitable for military and industrial applications.

Organization: 32X8

This organization allows for efficient data storage and retrieval, ideal for applications needing structured access to data.

Output Characteristics: 3-STATE

3-state outputs provide greater flexibility in interfacing with other components, enabling multiple devices to share the same bus.

Minimum Operating Temperature: -55 °C

A wide temperature range ensures performance in extreme conditions, making it suitable for military and aerospace applications.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options on the PCB and allows for more versatile assembly.

Maximum Seated Height: 2.159 mm

A low seated height ensures compatibility with low-profile designs, maintaining the overall compactness of electronic devices.

Width: 6.731 mm

A compact width provides versatility in design without compromising performance, fitting easily into various applications.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V enhances compatibility with lower power applications, ensuring versatility in design.

Temperature Grade: MILITARY

MILITARY-grade specifications indicate a robust and reliable design suited for demanding applications, ensuring long-term performance.

Technology: BIPOLAR

Bipolar technology provides high-speed operation and better performance in certain applications, ensuring reliability.

Parallel or Serial: PARALLEL

The parallel data interface allows for faster data retrieval, making it suitable for high-performance applications.

Terminal Form: FLAT

Flat terminals provide a secure and stable connection to the PCB, enhancing reliability during operation.

No. of Words: 32 words

32 words organization allows for adequate data storage, meeting the needs of various applications without excess complexity.

Memory Width: 8

An 8-bit memory width ensures sufficient data handling for many applications while maintaining manageable complexity.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers a good balance between density and manufacturing ease, helping in assembly and soldering.

No. of Words Code: 32

With 32 words of code, this product balances storage needs with performance, making it suitable for embedded applications.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V offers margin for design flexibility, ensuring reliable operation within a broad range of circuit conditions.

Memory Density: 256 bit

A memory density of 256 bits provides adequate space for applications requiring moderate data storage without unnecessary complexity.

Memory IC Type: OTP ROM

As an OTP ROM, it offers a one-time programmable feature that is ideal for applications such as firmware storage.

Maximum Access Time: 35 ns

With a maximum access time of 35 ns, this product ensures rapid data access, enhancing the overall performance of the system.

Technical Specifications

OTP ROM 82S123A/BFA attributes and parameters. Explore more OTP ROM devices from NXP Semiconductors

Specs

Maximum Access Time:

35 ns

JESD-30 Code:

R-CDFP-F16

Memory Density:

256 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32X8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

2.159 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

FLAT

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.731 mm

Trade Compliance

82S123A/BFA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20